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罗斌森
  • VSP3200YG4

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Part Status : Not For New Designs
    Type : CCD Signal Processor
    Applications : Scanners
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
LM4132EMFX-2.5 TI SOT-23-5 New 详细
LP3891ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
ADC12DL040CIVSX TI 64-TQFP (10x10) New 详细
SN74HC00N TI 14-PDIP New 详细
SN74AHC04PWR TI 14-TSSOP New 详细
TPS7A3001DRBT TI 8-SON (3x3) New 详细
DS90UB914A-CXEVM TI New 详细
TLV705165YFPR TI 4-DSBGA (0.78x0.78) New 详细
BQ76925PWR TI 20-TSSOP New 详细
TL2575-33IKV TI TO-220-5 New 详细
LM22670QTJE-ADJ/NOPB TI TO-263-7 Thin New 详细
LM2940T-5.0 TI TO-220-3 New 详细
PGA302EPWT TI 16-TSSOP New 详细
LM258AD TI 8-SOIC New 详细
BQ24735EVM-710 TI New 详细
TLV62568PDRLT TI SOT-563-6 New 详细
TLV431BIDCKR TI SC-70-6 New 详细
TPS2550DBVR TI SOT-23-6 New 详细
TPS79650DRBR TI 8-SON (3x3) New 详细
BQ4010YMA-70N TI 28-DIP Module (18.42x37.72) New 详细