产品系列
WL1805MODGBMOCT
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : WiLink?
Part Status : Active
RF Family/Standard : Bluetooth, WiFi
Protocol : 802.11b/g/n, Bluetooth 4.2
Modulation : CCK, DSSS, GFSK, OFDM
Frequency : 2.4GHz
Data Rate : 54Mbps
Power - Output : 17.3dBm
Sensitivity : -96.3dBm
Serial Interfaces : SDIO, UART
Voltage - Supply : 2.9V ~ 4.8V
Current - Receiving : 49mA ~ 85mA
Current - Transmitting : 238mA ~ 420mA
Mounting Type : Surface Mount
Operating Temperature : -20°C ~ 70°C
Package / Case : Module
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| BQ24260RGET | TI | 24-VQFN (4x4) | New | 详细 | |
| FCT162H501CTPVCTG4 | TI | 56-SSOP | New | 详细 | |
| TPS22904YFPT | TI | 4-DSBGA (0.8x0.8) | New | 详细 | |
| MSP430U275IPM | TI | 64-LQFP (10x10) | New | 详细 | |
| SN74LV166ADR | TI | 16-SOIC | New | 详细 | |
| PTH12000LAH | TI | New | 详细 | ||
| PT5123C | TI | New | 详细 | ||
| MSP430G2452IPW14 | TI | 14-TSSOP | New | 详细 | |
| FDC2214PROXSEN-EVM | TI | New | 详细 | ||
| SN74AS760DWR | TI | 20-SOIC | New | 详细 | |
| SN75LP196DBRG4 | TI | 20-SSOP | New | 详细 | |
| LM2594HVM-ADJ/NOPB | TI | 8-SOIC | New | 详细 | |
| LP3893ES-1.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TPS65193RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| TPS3806J20DBVR | TI | SOT-23-6 | New | 详细 | |
| MDL-LM3S818CNCD | TI | New | 详细 | ||
| UA78L05AILPR | TI | TO-92-3 | New | 详细 | |
| LM2698MM-ADJ | TI | 8-VSSOP | New | 详细 | |
| TPS62822DLCR | TI | 8-VSON-HR (2x1.5) | New | 详细 | |
| UC3705TG3 | TI | TO-220-5 | New | 详细 |
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