罗斌森
  • WL1831MODGBMOCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : WiLink?
    Part Status : Active
    RF Family/Standard : Bluetooth, WiFi
    Protocol : 802.11b/g/n, Bluetooth 4.2
    Modulation : CCK, DSSS, GFSK, OFDM
    Frequency : 2.4GHz
    Data Rate : 54Mbps
    Power - Output : 17.3dBm
    Sensitivity : -96.3dBm
    Serial Interfaces : SDIO, UART
    Voltage - Supply : 2.9V ~ 4.8V
    Current - Receiving : 49mA ~ 85mA
    Current - Transmitting : 238mA ~ 420mA
    Mounting Type : Surface Mount
    Operating Temperature : -20°C ~ 70°C
    Package / Case : 100-SMD Module

极速报价

型号
品牌 封装 批号 查看
LP2981-33MDBVREP TI SOT-23-5 New 详细
ADS8330IRSAT TI 16-QFN (4x4) New 详细
SN74LVT125DG4 TI 14-SOIC New 详细
UCC2839DG4 TI 14-SOIC New 详细
LMH6647MFX TI SOT-23-6 New 详细
THS1230IPW TI 28-TSSOP New 详细
PTB48540BAH TI New 详细
LMC6042AIMX/NOPB TI 8-SOIC New 详细
CD74HCT4060M96 TI 16-SOIC New 详细
TLV2432ID TI 8-SOIC New 详细
LP3985IBL-3.2/NOPB TI 5-DSBGA (1.41x1.08) New 详细
ADS7807PB TI 28-PDIP New 详细
OPA694IDBVT TI SOT-23-5 New 详细
TMS320VC5507ZHH TI 179-BGA MicroStar (12x12) New 详细
LM3S5K31-IQC80-C5 TI 100-LQFP (14x14) New 详细
SN74AHC126N TI 14-PDIP New 详细
SN74AHC16373DLR TI 48-SSOP New 详细
LMC7101AIM5X/NOPB TI SOT-23-5 New 详细
BQ25898YFFT TI 42-DSBGA New 详细
LM41CIMTX/NOPB TI 14-TSSOP New 详细