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WL1835MODGBMOCR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : WiLink?
Part Status : Active
RF Family/Standard : Bluetooth, WiFi
Protocol : 802.11b/g/n, Bluetooth 4.2
Modulation : CCK, DSSS, GFSK, OFDM
Frequency : 2.4GHz
Data Rate : 54Mbps
Power - Output : 17.3dBm
Sensitivity : -96.3dBm
Serial Interfaces : SDIO, UART
Voltage - Supply : 2.9V ~ 4.8V
Current - Receiving : 49mA ~ 85mA
Current - Transmitting : 238mA ~ 420mA
Mounting Type : Surface Mount
Operating Temperature : -20°C ~ 70°C
Package / Case : Module
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM3352MTCX-3.3 | TI | 16-TSSOP | New | 详细 | |
| ADS1194CZXGT | TI | 64-NFBGA (8x8) | New | 详细 | |
| ADS7822EB/2K5 | TI | 8-VSSOP | New | 详细 | |
| SN74LS175NG4 | TI | New | 详细 | ||
| LP3972SQE-A413/NOPB | TI | 40-WQFN (5x5) | New | 详细 | |
| SN74AHCT367DR | TI | 16-SOIC | New | 详细 | |
| LM2574N-5.0 | TI | 8-PDIP | New | 详细 | |
| OPA2670IRGVT | TI | 16-VQFN-EP (4x4) | New | 详细 | |
| SN74LVC827APW | TI | 24-TSSOP | New | 详细 | |
| SN74HC541PW | TI | 20-TSSOP | New | 详细 | |
| SN75HVD07D | TI | 8-SOIC | New | 详细 | |
| LMC7211BIM/NOPB | TI | 8-SOIC | New | 详细 | |
| SN74CB3Q16245DGVR | TI | 48-TVSOP | New | 详细 | |
| ADS1261BIRHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| SN75LVDM976DGGR | TI | 56-TSSOP | New | 详细 | |
| MSP430F47186IPZR | TI | 100-LQFP (14x14) | New | 详细 | |
| OPA357AIDBVR | TI | SOT-23-6 | New | 详细 | |
| LPV358DR | TI | 8-SOIC | New | 详细 | |
| CD4724BNSRG4 | TI | 16-SO | New | 详细 | |
| UC3525BDW | TI | 16-SOIC | New | 详细 |
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