产品系列
X4MF03107SPZQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS470M ARM? Cortex?-M3
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 16/32-Bit
Speed : 80MHz
Connectivity : CANbus, LINbus, MibSPI, SCI, UART/USART
Peripherals : POR, WDT
Number of I/O : 49
Program Memory Size : 320KB (320K x 8)
Program Memory Type : FLASH
RAM Size : 16K x 8
Voltage - Supply (Vcc/Vdd) : 1.4V ~ 1.7V
Data Converters : A/D 16x10b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 100-LQFP
Supplier Device Package : 100-LQFP (14x14)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| OPA1688ID | TI | 8-SOIC | New | 详细 | |
| TPA3121D2PWP | TI | 24-HTSSOP | New | 详细 | |
| CY74FCT480BTSOCTE4 | TI | 24-SOIC | New | 详细 | |
| SN74BCT2244NSRE4 | TI | 20-SO | New | 详细 | |
| LM45CIM3 | TI | SOT-23-3 | New | 详细 | |
| LP3964ESX-5.0 | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM258AMDREP | TI | 8-SOIC | New | 详细 | |
| TPS25940LRVCR | TI | 20-WQFN (4x3) | New | 详细 | |
| DS25BR120TSDX/NOPB | TI | 8-WSON (3x3) | New | 详细 | |
| LM317K STEEL/NOPB | TI | TO-3-2 | New | 详细 | |
| LM3S6950-EQC50-A2T | TI | 100-LQFP (14x14) | New | 详细 | |
| DRV593VFPR | TI | 32-HLQFP (7x7) | New | 详细 | |
| ADS8370IBRHPRG4 | TI | 28-VQFN-EP (6x6) | New | 详细 | |
| TL16C552FNR | TI | 68-PLCC (24.23x24.23) | New | 详细 | |
| SN74LVT573DW | TI | 20-SOIC | New | 详细 | |
| TMDXEVM368 | TI | New | 详细 | ||
| LM4808MM/NOPB | TI | 8-VSSOP | New | 详细 | |
| TLC549IDRG4 | TI | 8-SOIC | New | 详细 | |
| LME49600TSBD | TI | New | 详细 | ||
| SN74AUP1G04DRY2 | TI | 6-SON (1.45x1) | New | 详细 |
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