产品系列

罗斌森
  • X66AK2G02ZBB60

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : 66AK2G0x KeyStone II Multicore
    Part Status : Obsolete
    Type : DSP+ARM?
    Interface : CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
    Clock Rate : 600MHz
    Non-Volatile Memory : External
    On-Chip RAM : 1MB
    Voltage - I/O : 1.8V, 3.3V
    Voltage - Core : 0.9V
    Operating Temperature : 0°C ~ 90°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 625-LFBGA
    Supplier Device Package : 625-NFBGA (21x21)

极速报价

型号
品牌 封装 批号 查看
ADS1242IPWR TI 16-TSSOP New 详细
COP8SBR9KMT8 TI 56-TSSOP New 详细
TRS232EIDWR TI 16-SOIC New 详细
TMS320DM6467TCUT9 TI 529-FCBGA (19x19) New 详细
LM26CIM5X-XPA/NOPB TI SOT-23-5 New 详细
SN74AHCT16541DL TI 48-SSOP New 详细
SN74LV05ADBR TI 14-SSOP New 详细
ADC3422EVM TI New 详细
MSP430F6459IPZR TI 100-LQFP (14x14) New 详细
SN74LV08APWRG4 TI 14-TSSOP New 详细
TLV27L2IDR TI 8-SOIC New 详细
THS3125CPWPR TI 14-HTSSOP New 详细
LM74CIM-5/NOPB TI 8-SOIC New 详细
TPS92001DGKR TI 8-VSSOP New 详细
LM2936QMP-3.3/NOPB TI SOT-223-4 New 详细
TS5A3357DCUR TI US8 New 详细
TPS61122PWRG4 TI 16-TSSOP New 详细
LM2585S-3.3 TI DDPAK/TO-263-5 New 详细
BUF634F TI DDPAK/TO-263-5 New 详细
LM78L05ACM/NOPB TI 8-SOIC New 详细