罗斌森
  • XCC2564MODNCMOET

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Part Status : Discontinued at Digi-Key
    RF Family/Standard : Bluetooth
    Protocol : Bluetooth v4.0 Dual Mode
    Modulation : DPSK, DQPSK, GFSK, GMSK
    Frequency : 2.4GHz
    Data Rate : 4Mbps
    Power - Output : 10dBm
    Sensitivity : -93dBm
    Serial Interfaces : UART
    Utilized IC / Part : CC2564
    Voltage - Supply : 2.2V ~ 4.8V
    Current - Receiving : 40.5mA ~ 41.2mA
    Current - Transmitting : 40.5mA ~ 41.2mA
    Mounting Type : Surface Mount
    Operating Temperature : -30°C ~ 70°C
    Package / Case : 33-SMD Module

极速报价

型号
品牌 封装 批号 查看
LMP7707MAX/NOPB TI 8-SOIC New 详细
CLVTH16245AQDGGRQ1 TI 48-TSSOP New 详细
MSP430F2419TZQWR TI 113-BGA Microstar Junior (7x7) New 详细
LP3964ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
SN74AUP2G126DCUR TI US8 New 详细
CDCE906PW TI 20-TSSOP New 详细
OPA544FKTTTG3 TI DDPAK/TO-263-5 New 详细
LM810M3-4.63 TI SOT-23-3 New 详细
LMF100CCN/NOPB TI 20-DIP New 详细
LPV358MX TI 8-SOIC New 详细
TPS70758PWP TI 20-HTSSOP New 详细
LP5996SD-3308/NOPB TI 10-SON (3x3) New 详细
DS14C89AM/NOPB TI 14-SOIC New 详细
TPS74012DGKT TI 8-VSSOP New 详细
DAC101C081CISD TI 6-WSON (2.2x2.5) New 详细
TPS65563ARGTT TI 16-QFN (3x3) New 详细
LM3S5G51-IBZ80-A2T TI 108-BGA (10x10) New 详细
SN74LVT125PWG4 TI 14-TSSOP New 详细
CDC960DLR TI 48-SSOP New 详细
OMAP3530DCBB TI 515-POP-FCBGA (12x12) New 详细