罗斌森
  • DS34S108GN+

  • Manufacturer : Maxim Integrated
    Packaging : Tray
    Part Status : Not For New Designs
    Type : TDM (Time Division Multiplexing)
    Applications : Data Transport
    Mounting Type : Surface Mount
    Package / Case : 484-BGA
    Supplier Device Package : 484-TEBGA (23x23)

极速报价

型号
品牌 封装 批号 查看
DG419DJ Maxim 8-PDIP New 详细
MAX11200EVKIT+ Maxim New 详细
DS1747P-70+ Maxim 34-PowerCap Module New 详细
MAX3097ECEE+ Maxim 16-QSOP New 详细
MAX13052ESA+ Maxim 8-SOIC New 详细
MAX6168BESA+T Maxim 8-SOIC New 详细
MAX2650EUS-T Maxim SOT-143-4 New 详细
ZLFBLST0S2064GR5621 Maxim 20-SOIC New 详细
MAX1262ACEI+T Maxim 28-QSOP New 详细
MAX135CWI Maxim 28-SOIC New 详细
MAX494CSD+ Maxim 14-SOIC New 详细
MAX1270BCAI Maxim 28-SSOP New 详细
MAX5906UEE+ Maxim 16-QSOP New 详细
MAX771EPA+ Maxim 8-PDIP New 详细
MAX3490ESA+T Maxim 8-SOIC New 详细
MAX5719AGSD+ Maxim 14-SOIC New 详细
MAX693ACPE Maxim 16-PDIP New 详细
MAX5940DESA+ Maxim 8-SOIC New 详细
MAX17575ATC+T Maxim 12-TDFN (3x3) New 详细
DS2720BU+T&R Maxim 8-uMAX New 详细