罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
LC709203FQH-01TWG ON 8-WDFN (3x4) New 详细
MMBF5460LT1G ON SOT-23-3 (TO-236) New 详细
NTHD3100CT1 ON ChipFET? New 详细
CS8126-1YTHA5G ON TO-220-5 Horizontal New 详细
CS8101YDWF20 ON 20-SOIC New 详细
SBT80-10Y-E ON SMP-FD New 详细
MUN5111T1G ON SC-70-3 (SOT323) New 详细
NCP302HSN09T1G ON 5-TSOP New 详细
FDD3680 ON TO-252 New 详细
2N6519BU ON TO-92-3 New 详细
MC74VHC1G03DTT1 ON 5-TSOP New 详细
2SK4065-DL-1E ON TO-263-2 New 详细
NTD4806NA-35G ON I-PAK New 详细
MM74HC688SJX ON New 详细
MMBF2201NT1G ON SC-70-3 (SOT323) New 详细
6N135SVM ON 8-SMD New 详细
FQA6N90C-F109 ON TO-3PN New 详细
BC549BTF ON TO-92-3 New 详细
HMA124V ON 4-SMD New 详细
NCP1602BEASNT1G ON 6-TSOP New 详细