罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
MC74LVXT8051MG ON 16-SOEIAJ New 详细
SZMMBZ5242BLT1G ON SOT-23-3 (TO-236) New 详细
MPSA14_D74Z ON TO-92-3 New 详细
SMMBFJ310LT3G ON SOT-23-3 (TO-236) New 详细
MKP1V160RL ON Axial New 详细
FSBB15CH60B ON New 详细
FDMC6679AZ ON 8-MLP (3.3x3.3) New 详细
CNY171FR2VM ON 6-SMD New 详细
MC100EL38DWG ON 20-SOIC New 详细
NCP1031MNTXG ON 8-DFN (4x4) New 详细
MM74HC157SJX ON 16-SOP New 详细
NB3N65027DTGEVB ON New 详细
CD4081BCN ON 14-PDIP New 详细
FAN21SV06EMPX ON 25-MLP (6x5) New 详细
1N5940BRLG ON Axial New 详细
FGH40N60UFDTU ON TO-247 New 详细
MBRS330T3G ON SMC New 详细
NCP561SN28T1 ON 5-TSOP New 详细
74LVX541MX ON 20-SOIC New 详细
QED221 ON New 详细