罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
1N5225B ON DO-35 New 详细
MC74HC4538AFEL ON 16-SOEIAJ New 详细
1SMC8.5AT3G ON SMC New 详细
MC74ACT245DTG ON 20-TSSOP New 详细
KA5M0280RTU ON TO-220F-4L New 详细
74ACT374MSAX ON New 详细
MUR405 ON DO-201AD New 详细
HLMP1485 ON T-1 New 详细
NBC12439AFNR2 ON 28-PLCC (11.51x11.51) New 详细
1N914B_S00Z ON DO-35 New 详细
NLAS4051DTR2G ON 16-TSSOP New 详细
FAN3228CMX-F085 ON 8-SOIC New 详细
74LCX374BQX ON New 详细
FDS6673BZ-F085 ON 8-SOIC New 详细
MC14518BDWR2G ON 16-SOIC New 详细
NLVHC74ADTR2G ON New 详细
MCR708A1 ON I-PAK New 详细
NC7WV17P6X ON SC-88 (SC-70-6) New 详细
FGB3245G2-F085 ON TO-263AB New 详细
MMBF5460LT1 ON SOT-23-3 (TO-236) New 详细