罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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MOC8106M ON 6-DIP New 详细
NCP4641H050T1G ON SOT-89-5 New 详细
MM74HCT374MTCX ON New 详细
FOD3120TSR2 ON 8-SMD New 详细
MOC3083FR2VM ON 6-SMD New 详细
P3P73F01FG-08TR ON 8-TSSOP New 详细
MC1403DR2G ON 8-SOIC New 详细
74ALVC16245MTDX ON 48-TSSOP New 详细
BZX85C4V7_T50A ON DO-204AL (DO-41) New 详细
NP3100SCT3G ON New 详细
FAN6520BMX ON 8-SOIC New 详细
FSL136HRL ON 8-LSOP New 详细
LV8127T-TLM-H ON 36-TSSOP New 详细
LA6595T-TLM-E ON 8-MSOP New 详细
HCPL0600R1V ON 8-SOIC New 详细
NB7L111MMNG ON 52-QFN (8x8) New 详细
GF1M ON SMA (DO-214AC) New 详细