罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
NCP561SN50T1G ON 5-TSOP New 详细
NTB30N06LT4 ON D2PAK New 详细
MPS6515 ON TO-92-3 New 详细
FDD9410-F085 ON D-PAK (TO-252) New 详细
MMBZ5252ELT1G ON SOT-23-3 (TO-236) New 详细
CS5157HGDR16G ON 16-SOIC New 详细
NLVHC165ADR2 ON 16-SOIC New 详细
NCP1011ST65T3G ON SOT-223 New 详细
CD4510BCN ON New 详细
NCP6335FFCT1G ON 20-WLCSP (1.62x2.02) New 详细
NP3500SCG ON New 详细
MPSH17G ON TO-92-3 New 详细
MC3423P1 ON 8-PDIP New 详细
BF246B ON TO-92-3 New 详细
MC74ACT245DTG ON 20-TSSOP New 详细
NTJS4151PT1 ON SC-88/SC70-6/SOT-363 New 详细
NCP1052XP136 ON 7-PDIP New 详细
CAT1641WI-45-GT3 ON 8-SOIC New 详细
MM74HC4514WM ON 24-SOP New 详细
FOD3150TSR2 ON 8-SMD New 详细