罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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MMBZ5233B ON SOT-23-3 New 详细
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TL431BVDMR2 ON Micro8? New 详细
MMSZ4V7ET1 ON SOD-123 New 详细
MMBZ5255ELT1 ON SOT-23-3 (TO-236) New 详细
CS5174EDR8 ON 8-SOIC New 详细
CAT25080VP2I-GT3 ON 8-TDFN (2x3) New 详细
MC100E016FNG ON 28-PLCC (11.51x11.51) New 详细
MOC3043SM ON 6-SMD New 详细
NCP1530DM25R2G ON Micro8? New 详细
MMBZ5234BLT3G ON SOT-23-3 (TO-236) New 详细
RFP22N10 ON TO-220-3 New 详细
NSCT3904LT1G ON SOT-23-3 (TO-236) New 详细
KSP8599TF ON TO-92-3 New 详细
NCP512SQ15T1 ON SC-88A (SC-70-5/SOT-353) New 详细
FES16BT ON TO-220AC New 详细
BZX55C56_T50R ON DO-35 New 详细