罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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NCP4308ADR2G ON 8-SOIC New 详细
FEBFOD8012-CAN-GEVB ON New 详细
74AC109SJ ON New 详细
NCP170BMX300TCG ON 4-XDFN (1x1) New 详细
CM1771-5006YJQ ON Die New 详细
CAT5111VI-50-T3 ON New 详细
LM2576TV-015 ON TO-220-5 New 详细
FPDB40PH60B ON New 详细
NCV3064MNTXG ON 8-DFN (4x4) New 详细
N01L63W2AB25I ON 48-BGA (6x8) New 详细
FAN23SV06PMPX ON 34-PQFN (5.5x5) New 详细
BZX85C33 ON DO-204AL (DO-41) New 详细
MC74VHC1G86DFT2G ON SC-88A (SC-70-5/SOT-353) New 详细
FMB3906 ON SuperSOT?-6 New 详细
MC100EP35D ON New 详细
FCPF16N60 ON TO-220F New 详细