罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
2SA1709S-AN ON 3-NMP New 详细
MBRD1035CTL ON DPAK New 详细
NCP5426SN13T1 ON 5-TSOP New 详细
NCV1117ST33T3 ON SOT-223 New 详细
BZX55C10_T50R ON DO-35 New 详细
NCP1093MNRG ON 10-DFN (3x3) New 详细
BC212B_D27Z ON TO-92-3 New 详细
MC74VHC259DTG ON 16-TSSOP New 详细
NCV2575D2T-5G ON D2PAK-5 New 详细
MBR0530T1G ON SOD-123 New 详细
CS5124XDR8 ON 8-SOIC New 详细
SMF70AT1G ON SOD-123FL New 详细
FAN5099M ON 16-SOIC New 详细
ADT7476ARQZ-REEL ON 24-QSOP New 详细
HMA2701BR3V ON 4-SMD New 详细
CAT5409WI-00-T1 ON 24-SOIC New 详细
74LVTH273SJX ON New 详细
MC100H646FN ON 28-PLCC (11.51x11.51) New 详细
NCP1835MN24T2 ON 10-DFN (3x3) New 详细
NTD85N02R-1G ON I-PAK New 详细