罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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FXL4TD245UMX ON 16-UMLP (1.8x2.6) New 详细
DM74ALS580AN ON 20-PDIP New 详细
74LVT2245WMX ON 20-SOIC New 详细
SA48A ON Axial New 详细
MC10H180FNG ON 20-PLCC (9x9) New 详细
MC10E167FN ON 28-PLCC (11.51x11.51) New 详细
MMBZ5233B ON SOT-23-3 New 详细
FCA16N60 ON TO-3PN New 详细
NTD14N03R ON DPAK New 详细
EFC4618R-TR ON EFCP1818-4CC-037 New 详细
ADT7462ACPZ-5RL7 ON 32-LFCSP-VQ (5x5) New 详细
H11AG13S ON 6-SMD New 详细
74VHC86SJX ON 14-SOP New 详细
MC10E158FNR2G ON 28-PLCC (11.51x11.51) New 详细
NSV60600MZ4T1G ON SOT-223-3 New 详细
FQP3N80 ON TO-220-3 New 详细
BC517_D75Z ON TO-92-3 New 详细
74HCT14DTR2G ON 14-TSSOP New 详细