罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
NCP81128GMNTXG ON 52-QFN (6x6) New 详细
MJE172STU ON TO-126-3 New 详细
NTMFS4837NHT3G ON 5-DFN (5x6) (8-SOFL) New 详细
SZMM3Z13VST1G ON SOD-323 New 详细
NBXSBA023LN1TAG ON 6-CLCC (7x5) New 详细
NVD4810NT4G-VF01 ON DPAK New 详细
MC10H176MEL ON New 详细
NCP1251CSN65T1G ON 6-TSOP New 详细
NCV86604D33R2G ON 8-SOIC New 详细
BDW93 ON TO-220-3 New 详细
FDS4897C ON 8-SOIC New 详细
UC3842BVD1 ON 8-SOIC New 详细
NVMFS5C410NLT1G ON 5-DFN (5x6) (8-SOFL) New 详细
MMBTA20LT1G ON SOT-23-3 (TO-236) New 详细
QED122 ON New 详细
MC14515BDWR2G ON 24-SOIC New 详细
FQI4P40TU ON I2PAK (TO-262) New 详细
NTJS3157NT2 ON SC-88/SC70-6/SOT-363 New 详细
MC74LVX86DR2 ON 14-SOIC New 详细
FAN5602MU33X ON 8-MSOP New 详细