罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
SZMM3Z6V2ST1G ON SOD-323 New 详细
FGA30N60LSDTU ON TO-3P New 详细
LB1920-E ON 28-DIP New 详细
1N5346B ON Axial New 详细
KSA614Y ON TO-220-3 New 详细
NTSB30120CTT4G ON D2PAK-3 New 详细
2N5087TA ON TO-92-3 New 详细
CAT4103AGEVB ON New 详细
KSC3503DSTSTU ON TO-126-3 New 详细
KA78M08RTF ON D-Pak New 详细
LM393DR2GH ON New 详细
LA5744TPGEVB ON New 详细
TN8D51A-HB11-E ON TO-220F5I5H-HB New 详细
74LVQ32SC ON 14-SOIC New 详细
FSFR2100U ON 9-SIP New 详细
1N5256B ON DO-35 New 详细
BZX84C15_D87Z ON SOT-23-3 (TO-236) New 详细
NB7L72MMNHTBG ON 16-QFN (3x3) New 详细
MC78L08ACPRE ON TO-92-3 New 详细
MC79L15ACPRP ON TO-92-3 New 详细