罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
MMSZ56T1G ON SOD-123 New 详细
DM74ALS174SJ ON New 详细
FXMAR2104UMX ON 12-UMLP (1.8x1.8) New 详细
FQD12N20TF ON D-Pak New 详细
BC639_J35Z ON TO-92-3 New 详细
NJD35N04G ON DPAK New 详细
MM3Z30VST1G ON SOD-323 New 详细
LE2464CXATBG ON 6-WLCSP (1.2x0.80) New 详细
DM74ALS174N ON New 详细
FM27C512Q90 ON 28-CDIP New 详细
NIV2161MTTAG ON 10-WDFN (3.5x2) New 详细
FQU8P10TU ON I-PAK New 详细
BC547BTAR ON TO-92-3 New 详细
MC100EP016AFAR2 ON 32-LQFP (7x7) New 详细
1N4447 ON DO-35 New 详细
MPSW01A ON TO-92 (TO-226) New 详细
ASM3P2814AF-08SR ON 8-SOIC New 详细
STK5FK-CA0D-E ON New 详细
MC100E404FN ON 28-PLCC (11.51x11.51) New 详细
CGS3316MX ON 8-SOIC New 详细