罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
NCV8506D2T25R4 ON D2PAK-7 New 详细
100302SC ON 24-SOP New 详细
ESD8008MUTAG ON 14-UDFN (5.5x1.5) New 详细
NTTFS4C25NTAG ON 8-WDFN (3.3x3.3) New 详细
FSQ110 ON 8-DIP New 详细
MC10H350MEL ON 16-SOEIAJ New 详细
NSPU3061N2T5G ON 2-X2DFN (1x0.6) New 详细
MC14556BCP ON 16-DIP New 详细
FDH633605 ON DO-35 New 详细
GBU6J ON GBU New 详细
NUF2030XV6T1 ON New 详细
NTMFS4C53NT1G ON 5-DFN (5x6) (8-SOFL) New 详细
NCP345SNT1 ON 5-TSOP New 详细
MPSA06RLRAG ON TO-92-3 New 详细
MC10EP51DTR2 ON New 详细
1N962BTR ON DO-35 New 详细
FDB8860 ON TO-263AB New 详细
NCP5050MTTXG ON 10-WDFN (3x3) New 详细
CM2009-02QR ON 16-QSOP New 详细
NM93CS06M ON 14-SOIC New 详细