罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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MC74HC597ADTR2G ON 16-TSSOP New 详细
MJD3055G ON DPAK New 详细
2SB1216S-TL-E ON 2-TP-FA New 详细
NCP1117ST20T3G ON SOT-223 New 详细
PN3645_D26Z ON TO-92-3 New 详细
MC10ELT22DG ON 8-SOIC New 详细
KSA643YBU ON TO-92-3 New 详细
ADM1032ARM-REEL ON Micro8? New 详细
NZ9F3V0ST5G ON SOD-923 New 详细
74ACT253SCX ON 16-SOIC New 详细
MC10H646FNR2 ON 28-PLCC (11.51x11.51) New 详细
NBXSBA020LN1TAG ON 6-CLCC (7x5) New 详细
XNL17SV08XV5T2G ON New 详细
7WBD3305BMX1TCG ON 8-ULLGA (1.6x1) New 详细
FDS7296N3 ON 8-SO New 详细
FAN7528MX ON 8-SOP New 详细