罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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FDC699P_F077 ON SuperSOT?-6 FLMP New 详细
1N4003 ON DO-41 New 详细
MC10E164FNR2G ON 28-PLCC (11.51x11.51) New 详细
STK672-340-E ON 12-SIP New 详细
SA12CA ON DO-15 New 详细
NTB23N03R ON D2PAK New 详细
MPSL51_D26Z ON TO-92-3 New 详细
QSD422 ON New 详细
MC100LVEP111MNG ON 32-QFN (5x5) New 详细
2SA2040-TL-E ON 2-TP-FA New 详细
2N5485_D75Z ON TO-92-3 New 详细
MC74LVX14DTR2 ON 14-TSSOP New 详细
LC823450REFD-PCBA-GEVK ON New 详细
KAI-72PIN-HEAD-BD-A-GEVB ON New 详细
FDU8878 ON I-PAK New 详细
MC74AC138MG ON 16-SOEIAJ New 详细