罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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NCV4269AD133R2G ON 8-SOIC New 详细
FAN7362MX ON 8-SOP New 详细
DM74ALS1004N ON 14-PDIP New 详细
NCV3063PG ON 8-PDIP New 详细
MMBT2907AWT1 ON SC-70-3 (SOT323) New 详细
FAN7529M ON 8-SOP New 详细
MBD770DWT1G ON SC-88/SC70-6/SOT-363 New 详细
LC88F40F0PAU-QIP-H ON 100-QIPE (20x14) New 详细
CAT1022LI-42-G ON 8-PDIP New 详细
LA6242H-E ON 28-HSOP New 详细
NM27C256QE120 ON 28-CDIP New 详细
CAT1232LPV-GT3 ON 8-SOIC New 详细
N04L63W1AB27I ON 48-BGA (6x8) New 详细
NLV27WZ04DFT2G ON SC-88/SC70-6/SOT-363 New 详细
74ACT245SC ON 20-SOIC New 详细
NCP81018BMNR2G ON New 详细