罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
MPSA06RLRAG ON TO-92-3 New 详细
FOD2743ASDV ON 8-SMD New 详细
MPS750RLRAG ON TO-92-3 New 详细
NB3N3020DTR2G ON New 详细
FQU7N10LTU ON I-PAK New 详细
FIN1026MTCX ON 14-TSSOP New 详细
BFR30LT1 ON SOT-23-3 (TO-236) New 详细
HLMP6600A ON Subminiature T-3/4 New 详细
FDS2170N7 ON 8-SOIC New 详细
74LCX16244MTDX ON 48-TSSOP New 详细
MPSA55_D26Z ON TO-92-3 New 详细
FQA9P25 ON TO-3P New 详细
MC33262DR2 ON 8-SOIC New 详细
AMIS-53050-XTD ON 32-LQFP (7x7) New 详细
FJY3012R ON SOT-523F New 详细
FDMC8015L ON 8-MLP (3.3x3.3) New 详细
NCV612SQ50T1 ON SC-88A (SC-70-5/SOT-353) New 详细
FJX4010RTF ON SC-70 (SOT323) New 详细
MJ15023G ON TO-204 (TO-3) New 详细
FSA2269UMX ON 10-UMLP (1.8x1.4) New 详细