罗斌森
  • FES6D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
FDD45AN06LA0_F085 ON TO-252AA New 详细
1N6005B_T50R ON DO-35 New 详细
NB100LVEP56MNG ON 24-QFN (4x4) New 详细
MC100EP809FAG ON 32-LQFP (7x7) New 详细
FSA2258L10X ON 10-MicroPak? New 详细
MC14014BDR2G ON 16-SOIC New 详细
FQB9N15TM ON D2PAK (TO-263AB) New 详细
CD4044BCN ON 16-PDIP New 详细
NZ9F18VST5G ON SOD-923 New 详细
FOD3120TSR2V ON 8-SMD New 详细
74FST3245DWR2 ON 20-SOIC New 详细
NCP4681DSQ15T1G ON SC-88A (SC-70-5/SOT-353) New 详细
NLX1G11CMX1TCG ON 6-ULLGA (1x1) New 详细
MC33171DR2G ON 8-SOIC New 详细
NCP502SQ50T1G ON SC-88A (SC-70-5/SOT-353) New 详细
2N5551RLRP ON TO-92-3 New 详细
MBR2545CTG ON TO-220AB New 详细
H11C4W ON 6-DIP New 详细
74LCX543WM ON 24-SOP New 详细
NCP112P ON 14-PDIP New 详细