罗斌森
  • FES6D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
MCR22-6RLRA ON TO-92-3 New 详细
STK433-040NGEVB ON New 详细
MM74HCT240SJX ON 20-SOP New 详细
HMA121CR4 ON 4-SMD New 详细
FEB173 ON New 详细
SZBZX84C5V6ET3G ON SOT-23-3 (TO-236) New 详细
HUF75307T3ST ON SOT-223-4 New 详细
MPS6729G ON TO-92 (TO-226) New 详细
FDD5614P ON TO-252 New 详细
NCP59748MN2ADJTBG ON 20-QFN (5x5) New 详细
FDS6982S ON 8-SOIC New 详细
HUFA76443S3S ON D2PAK (TO-263AB) New 详细
NCP694D25HT1G ON SOT-89-5 New 详细
AX-SFEU-API-1-01-TB05 ON 40-QFN (7x5) New 详细
NTTFS4943NTWG ON 8-WDFN (3.3x3.3) New 详细
CS9202YDFR8G ON 8-SOIC New 详细
FQD5N60CTM_F080 ON D-Pak New 详细
1SMA43CAT3G ON SMA New 详细
BC547_J61Z ON TO-92-3 New 详细
74ACT573SJ ON 20-SOP New 详细