罗斌森
  • FES6D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
NCV2951ACDR2G ON 8-SOIC New 详细
FSDM07652RWDTU ON TO-220F-6L (Forming) New 详细
MC78M06CDTRK ON DPAK New 详细
FS8M ON TO-277-3 New 详细
PCP1208-TD-H ON PCP New 详细
74VHC574SJX ON New 详细
30C02MH-TL-H ON 3-MCPH New 详细
TL431BCLP ON TO-92-3 New 详细
74LVTH373WMX ON 20-SOIC New 详细
74LCX07BQX ON 14-DQFN (3x2.5) New 详细
FQPF1P50 ON TO-220F New 详细
UMA4NT1 ON SC-88A (SC-70-5/SOT-353) New 详细
FDMS3602AS ON Power56 New 详细
SBC848BLT1G ON SOT-23 New 详细
FFPF08H60STU ON TO-220F-2L New 详细
1.5KE11AG ON Axial New 详细
BD436STU ON TO-126-3 New 详细
LA6242H-TE-L-E ON 28-HSOP-HC New 详细
NCV8402AMNT2G ON New 详细
BC807-25WT1G ON SC-70-3 (SOT323) New 详细