罗斌森
  • FES6D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
BD159G ON TO-225AA New 详细
MC74LCX07DTR2G ON 14-TSSOP New 详细
FAN6100QMPX ON 20-MLPQ (3x4) New 详细
EGP10G ON DO-41 New 详细
NCP2809BGEVB ON New 详细
FAN2510SX ON SOT-23-5 New 详细
NDB6060L ON D2PAK (TO-263AB) New 详细
NC7NP14L8X ON 8-MicroPak? New 详细
ECH8656-TL-H ON 8-ECH New 详细
4N27SM ON 6-SMD New 详细
NCP382HD15AAGEVB ON New 详细
NGTB45N60S2WG ON TO-247-3 New 详细
LV8086T-TLM-H ON 24-TSSOP New 详细
ADT7482ARMZ-RL7 ON 10-MSOP New 详细
NCP1117DT20G ON DPAK New 详细
MBRM1H100T3G ON Powermite New 详细
LM2576D2TR4-3.3G ON D2PAK-5 New 详细
MM74HCT540WMX ON 20-SOIC New 详细
74AC109SC ON New 详细
NSVMMBD352WT1G ON SOT-323 New 详细