罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
LB1935FA-AH ON 10-Micro New 详细
1N5256B_T50R ON DO-35 New 详细
MPS2222ARL ON TO-92-3 New 详细
H11AA3SR2VM ON 6-SMD New 详细
CM1763-3204NR ON New 详细
PACUSB-U2Y6R ON SOT-23-6 New 详细
NCP5383MNR2G ON 24-QFN (4x4) New 详细
2SC4482U-AN ON 3-NMP New 详细
LV8112V-TLM-H ON 44-SSOPK New 详细
L14Q1F ON New 详细
MC74LVXT4052DR2G ON 16-SOIC New 详细
MC100E158FNR2G ON 28-PLCC (11.51x11.51) New 详细
NDS8852H ON 8-SOIC New 详细
74LCXH16374G ON New 详细
NCP1055GEVB ON New 详细
FODM3053 ON 4-SMD New 详细
MMBT2369ALT1G ON SOT-23-3 (TO-236) New 详细
MOC3022SVM ON 6-SMD New 详细
MC10H605FN ON 28-PLCC (11.51x11.51) New 详细
74VCX245WM ON 20-SOIC New 详细