罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
NCP4586DMU28TCG ON 4-UDFN (1.0x1.0) New 详细
H11D4W ON 6-DIP New 详细
1N5938BG ON Axial New 详细
FDMS86104 ON 8-PQFN (5x6) New 详细
DM74AS257SJ ON 16-SOP New 详细
NTZD5110NT1G ON SOT-563 New 详细
1N5819G ON Axial New 详细
KA378R05TU ON TO-220F-4L New 详细
NCV4274ADT33RKG ON DPAK New 详细
LM285D-1.2R2 ON 8-SOIC New 详细
MC74AC02DR2 ON 14-SOIC New 详细
HUFA75344G3 ON TO-247 New 详细
MC74LVX04DTR2 ON 14-TSSOP New 详细
NCP161BFCT280T2G ON 4-WLCSP (0.64x0.64) New 详细
NCP434FCT2G ON 4-WLCSP (0.96x0.96) New 详细
FAN302HLMY-F117 ON 8-SOIC New 详细
GBPC1510W ON GBPC-W New 详细
FODM3012 ON 4-SMD New 详细
KSD1616GTA ON TO-92-3 New 详细
74AC86MTC ON 14-TSSOP New 详细