罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
BS170RLRAG ON TO-92-3 New 详细
DM74ALS175SJX ON New 详细
FGA50N100BNTDTU ON TO-3P New 详细
FOD617B300W ON 4-DIP New 详细
MBR60H100CTG ON TO-220AB New 详细
NSVR0240V2T1G ON SOD-523 New 详细
2N5400_D75Z ON TO-92-3 New 详细
MJD122T4G ON DPAK New 详细
ADP3188JRUZ-REEL ON 28-TSSOP New 详细
MMUN2233LT1G ON SOT-23-3 (TO-236) New 详细
SZBZX84C75LT1G ON SOT-23-3 (TO-236) New 详细
LP2950ACDT-3.0RK ON DPAK New 详细
74LVX244SJX ON 20-SOP New 详细
BC847BPDW1T1G ON SC-88/SC70-6/SOT-363 New 详细
MMBZ5241BLT1G ON SOT-23-3 (TO-236) New 详细
KA78L15AZTA ON TO-92-3 New 详细
FOD0721 ON 8-SOIC New 详细
KAC-06040-ABA-JD-AA ON 237-MicroCPGA (42.5x38.1) New 详细
CD4538BCMX ON 16-SOIC New 详细
2SJ652-RA11 ON TO-220ML New 详细