罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
FQPF10N60C ON TO-220F New 详细
NCP1117DT18T5G ON DPAK New 详细
NLX1G57BMX1TCG ON 6-ULLGA (1.2x1) New 详细
NCP717AMX250TCG ON 4-XDFN (1x1) New 详细
74ABT541CMSAX ON 20-SSOP New 详细
KA3524 ON 16-PDIP New 详细
FOD053LR2 ON 8-SOIC New 详细
CM2020-00TR ON 38-TSSOP New 详细
H11A3TM ON 6-DIP New 详细
LB8649W-TBM-E ON 48-SQFP (7x7) New 详细
MMSZ4714T1G ON SOD-123 New 详细
NSBC114TDXV6T1 ON SOT-563 New 详细
BF393G ON TO-92-3 New 详细
NCS2004SQ3T2G ON SC-88A (SC-70-5/SOT-353) New 详细
FAN5345S20X ON SuperSOT?-6 New 详细
MJF45H11G ON TO-220FP New 详细
FCPF11N60NT ON TO-220F New 详细
MUR3060WTG ON TO-247 New 详细
MC74HCU04ADR2G ON 14-SOIC New 详细
LC75827W-SH-E ON 64-SQFP (10x10) New 详细