罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
HCPL2503SDV ON 8-SMD New 详细
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FJP13007H1 ON TO-220-3 New 详细
FDPF79N15 ON TO-220F New 详细
NSVJ3557SA3T1G ON SC-59-3/CP3 New 详细
BD676A ON TO-225AA New 详细
MC74HC14ANG ON 14-PDIP New 详细
FMBSA56 ON SuperSOT?-6 New 详细
MPSA42RLRMG ON TO-92-3 New 详细
NC7SP158L6X ON 6-MicroPak New 详细
MC74HC32AFEL ON SOEIAJ-14 New 详细
FAN5611MPX ON 6-MLP (2x2) New 详细
NCP5422ADR2G ON 16-SOIC New 详细
MM5Z3V3 ON SOD-523F New 详细
MC33164P-5G ON TO-92-3 New 详细
NUF2114MNT1G ON New 详细
1N5334BRL ON Axial New 详细
LA4814V-TLM-E ON 14-HSSOP New 详细
NCV8406ASTT1G ON SOT-223 (TO-261) New 详细