罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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BZX84C22LT1 ON SOT-23-3 (TO-236) New 详细
MC74HC125AFELG ON SOEIAJ-14 New 详细
NTMFS5C404NLT1G ON 5-DFN (5x6) (8-SOFL) New 详细
MC7824BD2TR4G ON D2PAK-3 New 详细
100314QCX ON 28-PLCC (11.43x11.43) New 详细
MM3Z39VT1 ON SOD-323 New 详细
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KAI-0340-AAA-CP-AA-SINGLE ON 22-CDIP New 详细
1N957B_T50R ON DO-35 New 详细
NCP1234BD100R2G ON 7-SOIC New 详细
NCP4620DSN50T1G ON SOT-23-5 New 详细
MC74LVX86MELG ON SOEIAJ-14 New 详细
NLAS9431MTR2G ON 16-WQFN (1.8x2.6) New 详细
NCP305LSQ30T3 ON SC-82AB New 详细
NCV78L05ABDG ON 8-SOIC New 详细
74ALVC16244GX ON 54-FBGA (5.5x8) New 详细