罗斌森
  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
FXL4TD245BQX ON 16-DQFN (2.5x3.5) New 详细
NGTB75N65FL2WG ON TO-247 New 详细
74LCX14MX ON 14-SOIC New 详细
CPH6153-P-TL-E ON 6-CPH New 详细
MMSZ5231BT1 ON SOD-123 New 详细
KSH44H11ITU ON I-PAK New 详细
BZX84B22LT1G ON SOT-23-3 (TO-236) New 详细
1N4742A-T50A ON DO-41 New 详细
MOC81123S ON 6-SMD New 详细
CAT25080HU2I-GT3 ON 8-uDFN (2x2) New 详细
ADT7468ARQ ON 24-QSOP New 详细
DM74ALS00ASJX ON 14-SOP New 详细
NDT014 ON SOT-223-4 New 详细
NLU2G06MUTCG ON 6-UDFN (1.2x1) New 详细
FDD8876 ON TO-252AA New 详细
MAN6411C ON New 详细
MBRF20H100CTH ON New 详细
BF959G ON TO-92-3 New 详细
FQPF50N06 ON TO-220F New 详细
MBR2045MFST1G ON 5-DFN (5x6) (8-SOFL) New 详细