罗斌森
  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
H11C6S ON 6-SMD New 详细
MC10EP16DR2G ON 8-SOIC New 详细
MTB50P03HDLT4G ON D2PAK New 详细
SZMM3Z13VT1G ON SOD-323 New 详细
NCV8800SDW26 ON 16-SOIC New 详细
BZX55C6V8_T50R ON DO-35 New 详细
MC10H141FN ON 20-PLCC (9x9) New 详细
BC490AZL1 ON TO-92-3 New 详细
BZX84C10LT1G ON SOT-23-3 (TO-236) New 详细
74VHC132N ON 14-PDIP New 详细
H11AA3VM ON 6-DIP New 详细
MAN3880A ON New 详细
NCP694H12HT1G ON SOT-89-5 New 详细
KA258AD ON 8-SOIC New 详细
NTGD3147FT1G ON 6-TSOP New 详细
NLVHC541ADWR2 ON 20-SOIC New 详细
ADT7476ARQZ-REEL ON 24-QSOP New 详细
MC100EP140DG ON 8-SOIC New 详细
CAT24C164WI-G ON 8-SOIC New 详细
MC74LVX139MEL ON 16-SOEIAJ New 详细