罗斌森
  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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1V5KE9V1A ON DO-201AE New 详细
MC74LCX14MG ON SOEIAJ-14 New 详细
NCP137AFCTCADJT2G ON 6-WLCSP (1.2x0.80) New 详细
MR5460MP4A ON New 详细
NCV2575D2T-12G ON D2PAK-5 New 详细
1N752A_S00Z ON DO-35 New 详细
LA5752-E ON TO-220-5H New 详细
MC100E241FN ON 28-PLCC (11.51x11.51) New 详细
NCV4264-2CST33T3G ON SOT-223 (TO-261) New 详细
MC10EP35DR2G ON New 详细
CNX38UW ON 6-DIP New 详细
MC74LVX4245DTR2G ON 24-TSSOP New 详细
FJN4314RBU ON TO-92-3 New 详细
MICROFC-30020-SMT-TR1 ON New 详细
FFP08H60STU ON TO-220-2L New 详细
NCV78L05ABPRAG ON TO-92-3 New 详细