罗斌森
  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
MOC5007SR2M ON 6-SMD New 详细
PN3566_D75Z ON TO-92-3 New 详细
NCP4300ADG ON 8-SOIC New 详细
QPA8258 ON New 详细
MV2109RLRAG ON TO-92 New 详细
KA2903D ON 8-SOP New 详细
74VHC04MX ON 14-SOIC New 详细
FDG6303N_D87Z ON SC-88 (SC-70-6) New 详细
LV49152V-MPB-E ON 44-SSOPJ New 详细
NCH-RSL10-101Q48-ABG ON 48-QFN (6x6) New 详细
MC74VHC125DR2G ON 14-SOIC New 详细
MC74HC240ADTR2 ON 20-TSSOP New 详细
NLSV1T244MUTBG ON 6-UDFN (1.2x1) New 详细
MJE15033G ON TO-220AB New 详细
DM74ALS574AN ON New 详细
NVMFS6B05NLWFT3G ON 5-DFN (5x6) (8-SOFL) New 详细
P6SMB82AT3 ON SMB New 详细
NCP585HSN18T1 ON SOT-23-5 New 详细
NTB23N03RT4G ON D2PAK New 详细
BC547A ON TO-92-3 New 详细