罗斌森
  • MAX20323FENC+

  • Manufacturer : Maxim Integrated
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Applications : Mobile Communications
    Current - Supply : 35μA ~ 170μA
    Voltage - Supply : 2.5V ~ 5.5V
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 12-XFBGA, WLPBGA
    Supplier Device Package : 12-WLP (1.70x1.32)

极速报价

型号
品牌 封装 批号 查看
DS1233MS-5/T&R Maxim 8-SOIC New 详细
MAX3082CSA+T Maxim 8-SOIC New 详细
73M1902-IVT/F Maxim 20-TSSOP New 详细
MAX385CPE+ Maxim 16-PDIP New 详细
MAX504CSD Maxim 14-SOIC New 详细
MAX3370EXK+T Maxim SC-70-5 New 详细
MAX5661GCB+T Maxim 64-LQFP (10x10) New 详细
MAX4433EUA+T Maxim 8-uMAX New 详细
MAX6855UK30D3+T Maxim SOT-23-5 New 详细
MAX1162CEUB+ Maxim 10-uMAX New 详细
MAX6368HKA23+T Maxim SOT-23-8 New 详细
MAX3208EATE+ Maxim 16-TQFN (3x3) New 详细
MAX6865UK26D2L+T Maxim SOT-23-5 New 详细
MAX1153BEUE+ Maxim 16-TSSOP New 详细
MAX4676EUT+T Maxim SOT-23-6 New 详细
MAX6338CUB+ Maxim 10-uMAX New 详细
MAX6709OUB+ Maxim 10-uMAX New 详细
MAX17035ETG+ Maxim 24-TQFN (4x4) New 详细
MAX40088AUT+ Maxim SOT-23-6 New 详细
MAX6310UK38D2-T Maxim SOT-23-5 New 详细