罗斌森
  • MAX20323FENC+

  • Manufacturer : Maxim Integrated
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Applications : Mobile Communications
    Current - Supply : 35μA ~ 170μA
    Voltage - Supply : 2.5V ~ 5.5V
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 12-XFBGA, WLPBGA
    Supplier Device Package : 12-WLP (1.70x1.32)

极速报价

型号
品牌 封装 批号 查看
DS3134 Maxim 256-BGA (27x27) New 详细
MAX990EUA Maxim 8-uMAX New 详细
MAX4603EAE+ Maxim 16-SSOP New 详细
MAX6934AQH+TD Maxim 44-PLCC (16.59x16.59) New 详细
MAX953EPA+ Maxim 8-PDIP New 详细
MAX985EBT+TG45 Maxim 6-UCSP (1x1.52) New 详细
MAX7304PMB1# Maxim New 详细
MAX4622CSE+T Maxim 16-SO New 详细
MAX6505UTP105+ Maxim SOT-23-6 New 详细
MAX3241EEWI Maxim 28-SO New 详细
MAX4062EUB+T Maxim 10-uMAX New 详细
MAX5735AUTN+T Maxim 56-TQFN (8x8) New 详细
MAX7347ATE+T Maxim 16-TQFN (4x4) New 详细
MAX16815ASA+ Maxim 8-SOIC-EP New 详细
MAX6865UK34D5L+T Maxim SOT-23-5 New 详细
MAX329CPE Maxim 16-PDIP New 详细
MAX1236KEUA+T Maxim 8-uMAX New 详细
MAX995ESD Maxim 14-SOIC New 详细
MAX34461ETM+ Maxim 48-TQFN-EP (6x6) New 详细
DS2490S Maxim 24-SOIC New 详细