产品系列

罗斌森
  • FOD260LSDV

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Number of Channels : 1
    Inputs - Side 1/Side 2 : 1/0
    Voltage - Isolation : 5000Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Input Type : DC
    Output Type : Open Collector, Schottky Clamped
    Current - Output / Channel : 50mA
    Data Rate : 10Mbps
    Propagation Delay tpLH / tpHL (Max) : 90ns, 75ns
    Rise / Fall Time (Typ) : 22ns, 3ns
    Voltage - Forward (Vf) (Typ) : 1.4V
    Current - DC Forward (If) (Max) : 50mA
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-SMD, Gull Wing
    Supplier Device Package : 8-SMD

极速报价

型号
品牌 封装 批号 查看
MBRB2545CTT4G ON D2PAK-3 New 详细
MBR10L60CTG ON TO-220AB New 详细
MC74LCX257DTR2G ON 16-TSSOP New 详细
74ABT126CSC ON 14-SOIC New 详细
FSA2267L10X ON 10-MicroPak? New 详细
NCP81119AMNTXG ON New 详细
NCP4894DMR2G ON 10-Micro New 详细
ILC6383CIR50X ON 8-MSOP New 详细
BC182AG ON TO-92-3 New 详细
MPSA13_D75Z ON TO-92-3 New 详细
ATP613-TL-H ON ATPAK New 详细
1.5KE15ARL4 ON Axial New 详细
SZMM5Z20VT1G ON SOD-523 New 详细
NSIC2050JBT3G ON SMB New 详细
H11A617D300W ON 4-DIP New 详细
NCV612SQ31T1 ON SC-88A (SC-70-5/SOT-353) New 详细
MM74HC4050M ON 16-SOIC New 详细
GMC8675C ON New 详细
FST3384QSC ON 24-QSOP New 详细
FDD86581-F085 ON D-PAK (TO-252) New 详细