产品系列

罗斌森
  • FOD817A3SD

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Number of Channels : 1
    Voltage - Isolation : 5000Vrms
    Current Transfer Ratio (Min) : 80% @ 5mA
    Current Transfer Ratio (Max) : 160% @ 5mA
    Rise / Fall Time (Typ) : 4μs, 3μs
    Input Type : DC
    Output Type : Transistor
    Voltage - Output (Max) : 70V
    Current - Output / Channel : 50mA
    Voltage - Forward (Vf) (Typ) : 1.2V
    Current - DC Forward (If) (Max) : 50mA
    Vce Saturation (Max) : 200mV
    Operating Temperature : -55°C ~ 110°C
    Mounting Type : Surface Mount
    Package / Case : 4-SMD, Gull Wing
    Supplier Device Package : 4-SMD

极速报价

型号
品牌 封装 批号 查看
NB2308AC1DR2G ON 16-SOIC New 详细
NCS20062DR2G ON 8-SOIC New 详细
NCP4545IMNTWG ON 18-QFN (3x3) New 详细
DM74ALS245AWMX ON 20-SOIC New 详细
FDMS86320 ON 8-PQFN (5x6) New 详细
NCP1247USBPDGEVB ON New 详细
CAT1641WI-45-GT3 ON 8-SOIC New 详细
LC75853NE-E ON 64-QIPE (14x14) New 详细
2N5485_D74Z ON TO-92-3 New 详细
74AC245SCX ON 20-SOIC New 详细
1N5336BG ON Axial New 详细
NST3946DP6T5G ON SOT-963 New 详细
MC33275D-5.0R2 ON 8-SOIC New 详细
BC32816TA ON TO-92-3 New 详细
SZMM3Z15VT1G ON SOD-323 New 详细
MMSZ4710T1G ON SOD-123 New 详细
MURB1660CTG ON D2PAK-3 New 详细
NRVB0530T3G ON SOD-123 New 详细
FXLA0104QFX-F106 ON 12-UMLP (1.7x2) New 详细
MJD112-001 ON I-PAK New 详细