产品系列
产品系列
XC7Z010-2CLG400I
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 766MHz
Primary Attributes : Artix?-7 FPGA, 28K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 400-LFBGA, CSPBGA
Supplier Device Package : 400-CSPBGA (17x17)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC6SLX25T-N3FG484C | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XC17128EPC20C | Xilinx | 20-PLCC (9x9) | New | 详细 | |
| XC7A200T-L1FB676I | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC4003E-3PQ100C | Xilinx | 100-PQFP (20x14) | New | 详细 | |
| XCV200-5FG256I | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| HW-SPAR3ADDR2-DK-UNI-G | Xilinx | New | 详细 | ||
| XC6VHX250T-2FFG1154I | Xilinx | 1156-FCBGA (35x35) | New | 详细 | |
| XC17V04PC44I | Xilinx | 44-PLCC (16.59x16.59) | New | 详细 | |
| XA3S1000-4FGG456Q | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| EF-DI-RIO-PHY-SITE | Xilinx | New | 详细 | ||
| XC5VSX50T-1FFG665CES | Xilinx | 665-FCBGA (27x27) | New | 详细 | |
| XC2S200E-6PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| EF-DI-SMPTE2022-56-SITE | Xilinx | New | 详细 | ||
| XC4VFX60-10FF1152I | Xilinx | 1152-CFCBGA (35x35) | New | 详细 | |
| XCZU6EG-L1FFVC900I | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XC7S25-1FTGB196I | Xilinx | 196-CSBGA (15x15) | New | 详细 | |
| XC2V2000-5BGG575I | Xilinx | 575-BGA (31x31) | New | 详细 | |
| XC7VX415T-2FF1927I | Xilinx | 1927-FCBGA (45x45) | New | 详细 | |
| XC7Z030-2FB484I | Xilinx | 484-FCBGA (23x23) | New | 详细 | |
| XCS30XL-4VQ100C | Xilinx | 100-VQFP (14x14) | New | 详细 |
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