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XC7Z030-1SBG485C
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 484-FBGA
Supplier Device Package : 485-FBGA (19x19)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC6VLX195T-1FF784I | Xilinx | 784-FCBGA (29x29) | New | 详细 | |
| XCV200E-6FG456C | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XC17S05VO8C | Xilinx | 8-TSOP | New | 详细 | |
| XCV400E-6FG676I | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC18V04VQ44I | Xilinx | 44-VQFP (10x10) | New | 详细 | |
| A-U250-A64G-PQ-G | Xilinx | New | 详细 | ||
| XC4005XL-3TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XC7K325T-L2FBG900I | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| EFR-DI-CTC-80216E-DEC-SITE | Xilinx | New | 详细 | ||
| XC17S30XLVO8C | Xilinx | 8-TSOP | New | 详细 | |
| XC9572-15TQG100I | Xilinx | 100-TQFP (14x14) | New | 详细 | |
| XC2VP30-7FFG896C | Xilinx | 896-FCBGA (31x31) | New | 详细 | |
| XC17S30XLVOG8I | Xilinx | 8-TSOP | New | 详细 | |
| XC7V2000T-1FHG1761I | Xilinx | 1761-FCBGA (45x45) | New | 详细 | |
| XC17V02PC44I | Xilinx | 44-PLCC (16.59x16.59) | New | 详细 | |
| XC5VLX30-2FF676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC7A200T-2FBG676I | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC5VLX30-1FFG324CES | Xilinx | 324-FCBGA (19x19) | New | 详细 | |
| XC7S100-2FGGA676I | Xilinx | 676-FPBGA (27x27) | New | 详细 | |
| XC2V2000-4FGG676C | Xilinx | 676-FBGA (27x27) | New | 详细 |
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