产品系列
产品系列
XC7Z030-2FBG676I
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XCV50-5BG256C | Xilinx | 256-PBGA (27x27) | New | 详细 | |
| XC4013XL-3BG256C | Xilinx | 256-PBGA (27x27) | New | 详细 | |
| XCS40XL-4BG256I | Xilinx | 256-PBGA (27x27) | New | 详细 | |
| XC7Z020-1CLG400CES | Xilinx | 400-CSPBGA (17x17) | New | 详细 | |
| XCV200-6FG256C | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| XC7K420T-3FFG901E | Xilinx | 901-FCBGA (31x31) | New | 详细 | |
| XCV150-6BG256C | Xilinx | 256-PBGA (27x27) | New | 详细 | |
| XC95108-10PQ100I | Xilinx | 100-PQFP (20x14) | New | 详细 | |
| XC17S150AVO8C | Xilinx | 8-TSOP | New | 详细 | |
| XCS30-4TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XCV600-4FG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XCV200E-8FG456C | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XC7K70T-3FBG676E | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC2V8000-4FFG1152I | Xilinx | 1152-FCBGA (35x35) | New | 详细 | |
| XC6VLX550T-1FFG1759I | Xilinx | 1759-FCBGA (42.5x42.5) | New | 详细 | |
| XC7S50-L1CSGA324I | Xilinx | 324-FPGA (15x15) | New | 详细 | |
| XC7VX690T-L2FFG1926E | Xilinx | 1926-FCBGA (45x45) | New | 详细 | |
| XC7VX330T-1FF1157I | Xilinx | 1157-FCBGA (35x35) | New | 详细 | |
| XC5204-6VQ100C | Xilinx | 100-VQFP (14x14) | New | 详细 | |
| XC17S30APD8I | Xilinx | 8-PDIP | New | 详细 |
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