产品系列
产品系列
XC7Z030-3FBG676E
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 1GHz
Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CK-V6-ML623-G | Xilinx | New | 详细 | ||
| XC6VLX240T-2FFG784C | Xilinx | 784-FCBGA (29x29) | New | 详细 | |
| XC2V500-5FG456I | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XCS20-3VQ100C | Xilinx | 100-VQFP (14x14) | New | 详细 | |
| XCV300E-8FG456C | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XCS40XL-4PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC2VP7-7FF672C | Xilinx | 672-FCBGA (27x27) | New | 详细 | |
| XC5VLX50-2FF1153I | Xilinx | 1153-FCBGA (35x35) | New | 详细 | |
| DK-V6-EMBD-G-J | Xilinx | New | 详细 | ||
| XC2V3000-5FF1152I | Xilinx | 1152-CFCBGA (35x35) | New | 详细 | |
| XC4010E-1PC84C | Xilinx | 84-PLCC (29.31x29.31) | New | 详细 | |
| XC6SLX45-3CSG324I | Xilinx | 324-CSPBGA (15x15) | New | 详细 | |
| XC4003E-4VQ100I | Xilinx | 100-VQFP (14x14) | New | 详细 | |
| XC17128ELVO8I | Xilinx | 8-TSOP | New | 详细 | |
| XCV200E-8FG456C | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XC3S400AN-4FTG256I | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| XC7K325T-1FBG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC95216-10HQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC9572-10PCG44C | Xilinx | 44-PLCC (16.59x16.59) | New | 详细 | |
| XCV50-5TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 |
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