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  • XC7Z035-1FBG676C

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 667MHz
    Primary Attributes : Kintex?-7 FPGA, 275K Logic Cells
    Operating Temperature : 0°C ~ 85°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

极速报价

型号
品牌 封装 批号 查看
XC7Z030-1FB484I Xilinx 484-FCBGA (23x23) New 详细
XC7Z030-2SBG485E Xilinx 485-FBGA (19x19) New 详细
XCZU2CG-L1SFVC784I Xilinx 784-FCBGA (23x23) New 详细
EF-DI-RSD-SITE Xilinx New 详细
XC1736ESOG8C Xilinx 8-SOIC New 详细
XC1765ELPC20C Xilinx 20-PLCC (9x9) New 详细
XC17S50AVO8C Xilinx 8-TSOP New 详细
EK-U1-ZCU102-ES2-G-J Xilinx New 详细
XC17V01PC20I Xilinx 20-PLCC (9x9) New 详细
XC3SD1800A-4FGG676C Xilinx 676-FBGA (27x27) New 详细
XC2V2000-6BGG575C Xilinx 575-BGA (31x31) New 详细
XC7K410T-L2FFG676E Xilinx 676-FCBGA (27x27) New 详细
XC6SLX9-2CSG225C Xilinx 225-CSPBGA (13x13) New 详细
XC4028XL-3BG256I Xilinx 256-PBGA (27x27) New 详细
XC17S150AVO8I Xilinx 8-TSOP New 详细
DO-DI-TPCENC Xilinx New 详细
XC3S1400AN-4FGG484I Xilinx 484-FBGA (23x23) New 详细
XC4010XL-09TQ144C Xilinx 144-TQFP (20x20) New 详细
XC5VLX85-1FFG1153I Xilinx 1153-FCBGA (35x35) New 详细
XC4VLX80-12FF1148C Xilinx 1148-FCPBGA (35x35) New 详细