产品系列
产品系列
XC7Z035-3FFG676E
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex?-7 FPGA, 275K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC4013E-3BG225I | Xilinx | 225-PBGA (27x27) | New | 详细 | |
| XC7Z030-3FFG676E | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC3S700A-4FTG256C | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| XC6VLX550T-2FFG1759C | Xilinx | 1759-FCBGA (42.5x42.5) | New | 详细 | |
| XC2V1000-4BGG575I | Xilinx | 575-BGA (31x31) | New | 详细 | |
| XC5VSX50T-1FFG665I | Xilinx | 665-FCBGA (27x27) | New | 详细 | |
| XC5VLX110-3FFG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XCV150-4FG256C | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| DX-DI-RSD-TO-DP-AUDIO | Xilinx | New | 详细 | ||
| XC17S05PD8I | Xilinx | 8-PDIP | New | 详细 | |
| XC4003-6PQ100C | Xilinx | 100-PQFP (20x14) | New | 详细 | |
| XC4013-5PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC17S30XLVOG8I | Xilinx | 8-TSOP | New | 详细 | |
| XA6SLX75-2FGG484I | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XCV812E-8FG900C | Xilinx | 900-FBGA (31x31) | New | 详细 | |
| XCV600E-6FG676I | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XCZU6EG-2FFVC900E | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XCS20XL-4PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC6VHX255T-2FFG1155I | Xilinx | 1156-FCBGA (35x35) | New | 详细 | |
| XC7VX690T-L2FF1926E | Xilinx | 1926-FCBGA (45x45) | New | 详细 |
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