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  • XC7Z045-2FFG900I

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 800MHz
    Primary Attributes : Kintex?-7 FPGA, 350K Logic Cells
    Operating Temperature : -40°C ~ 100°C (TJ)
    Package / Case : 900-BBGA, FCBGA
    Supplier Device Package : 900-FCBGA (31x31)

极速报价

型号
品牌 封装 批号 查看
XC17S20VO8C Xilinx 8-TSOP New 详细
XC2VP70-5FF1517I Xilinx 1517-FCBGA (40x40) New 详细
XC5VLX110-2FF1153C Xilinx 1153-FCBGA (35x35) New 详细
XC6VHX250T-2FFG1154I Xilinx 1156-FCBGA (35x35) New 详细
XC4013E-2PQ208C Xilinx 208-PQFP (28x28) New 详细
EF-DI-CTC-80216E-DEC-SITE Xilinx New 详细
XC18V02PC44C0936 Xilinx 44-PLCC (16.59x16.59) New 详细
XC5VLX220-1FF1760I Xilinx 1760-FCBGA (42.5x42.5) New 详细
XC7Z014S-2CLG484E Xilinx 484-CSPBGA (19x19) New 详细
XC2V250-5FGG456C Xilinx 456-FBGA (23x23) New 详细
XC17S10VOG8C Xilinx 8-TSOP New 详细
XC2VP30-7FFG1152C Xilinx 1152-FCBGA (35x35) New 详细
XA7A75T-1FGG484Q Xilinx 484-FBGA (23x23) New 详细
XC7Z035-2FBG676I Xilinx 676-FCBGA (27x27) New 详细
XC3S100E-4TQG144C Xilinx 144-TQFP (20x20) New 详细
XC2VP20-6FGG676C Xilinx 676-FBGA (27x27) New 详细
EF-DI-OBSAI-WW Xilinx New 详细
XC5VLX30-2FFG676C Xilinx 676-FCBGA (27x27) New 详细
XC5VLX110T-2FFG1738I Xilinx 1738-FCBGA (42.5x42.5) New 详细
XCV1000E-7FG900C Xilinx 900-FBGA (31x31) New 详细