罗斌森
  • 24FC02T-I/MUY

  • Manufacturer : Microchip Technology
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 8-UFDFN Exposed Pad
    Supplier Device Package : 8-UDFN (2x3)

极速报价

型号
品牌 封装 批号 查看
DSPIC33FJ128MC710T-I/PF Microchip 100-TQFP (14x14) New 详细
DSC-PROG-TIMEFLASH-5032 Microchip New 详细
MCP6242-E/SN Microchip 8-SOIC New 详细
PIC16C57T-HSE/SO Microchip 28-SOIC New 详细
TC54VC2502EZB Microchip TO-92-3 New 详细
ATSAML21E16B-MNT Microchip 32-VQFN (5x5) New 详细
PIC16LF18425-E/JQ Microchip 16-UQFN (4x4) New 详细
DSPIC33EV32GM103-I/M5 Microchip 36-UQFN (5x5) New 详细
DSC1101CL5020.0032EVB Microchip New 详细
PIC16C56/JW Microchip 18-CERDIP New 详细
AT24C01-10SI-1.8 Microchip 8-SOIC New 详细
MSL1061AV Microchip 28-TQFN (5x5) New 详细
DSC1001CL5-125.0000 Microchip New 详细
MCP809T-300I/TT Microchip SOT-23-3 New 详细
DSC400-3333Q0016KI1T Microchip New 详细
MCP6H02T-E/MNY Microchip 8-TDFN (2x3) New 详细
AT89C4051-12SC Microchip 20-SOIC New 详细
PIC18F14K22-I/ML Microchip 20-QFN (4x4) New 详细
MIC2076-1BM Microchip 8-SOIC New 详细
DSPIC33FJ128GP802-E/SO Microchip 28-SOIC New 详细