罗斌森
  • FR015L3EZ

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Voltage - Clamping : 15V
    Technology : Mixed Technology
    Number of Circuits : 1
    Applications : General Purpose
    Mounting Type : Surface Mount
    Package / Case : 6-WDFN Exposed Pad
    Supplier Device Package : 6-MicroFET (2x2)

极速报价

型号
品牌 封装 批号 查看
MC74LVX244M ON SOEIAJ-20 New 详细
NCV8405ADTRKG ON DPAK New 详细
FQB9N50CFTM ON D2PAK (TO-263AB) New 详细
MMSZ5V6T1 ON SOD-123 New 详细
CPH3360-TL-W ON 3-CPH New 详细
BAV23CLT1G ON SOT-23-3 (TO-236) New 详细
NCP331SNT1GEVB ON New 详细
MC74LVXT8053DTR2 ON 16-TSSOP New 详细
H11N1M ON 6-DIP New 详细
NCS2325DMR2G ON 8-Micro New 详细
LM2904M ON 8-SOIC New 详细
NLVVHC1GT08DFT2 ON SC-88A (SC-70-5/SOT-353) New 详细
NGTB50N60FWG ON TO-247 New 详细
NUF2030XV6T1 ON New 详细
FDMC86324 ON Power33 New 详细
H11D3300 ON 6-DIP New 详细
SD05T1G ON SOD-323 New 详细
KA3842AES ON 8-DIP New 详细
2N3906TAR ON TO-92-3 New 详细
FLZ6V8A ON SOD-80 New 详细