罗斌森
  • FR015L3EZ

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Voltage - Clamping : 15V
    Technology : Mixed Technology
    Number of Circuits : 1
    Applications : General Purpose
    Mounting Type : Surface Mount
    Package / Case : 6-WDFN Exposed Pad
    Supplier Device Package : 6-MicroFET (2x2)

极速报价

型号
品牌 封装 批号 查看
NJV4030PT3G ON SOT-223 (TO-261) New 详细
MM3Z3V0T1G ON SOD-323 New 详细
D45H8 ON TO-220AB New 详细
2N5401_D28Z ON TO-92-3 New 详细
FQA13N50C ON TO-3P New 详细
NTSB30U100CTT4G ON D2PAK-3 New 详细
MC74HC4316AFELG ON 16-SOEIAJ New 详细
BZX84B9V1LT1 ON SOT-23-3 (TO-236) New 详细
MST4940C ON New 详细
MC10EP16VAMNR4G ON 8-DFN (2x2) New 详细
BC32740BU ON TO-92-3 New 详细
FJN5471TA ON TO-92-3 New 详细
MR2502 ON Microde Button New 详细
NXH80B120H2Q0SG ON 20-PIM/Q0PACK (55x32.5) New 详细
74F540SC ON 20-SOIC New 详细
NCP1578MNR2G ON 20-QFN (4x4) New 详细
FCP11N60N ON TO-220-3 New 详细
LM2575D2T-15R4G ON D2PAK-5 New 详细
LC824206XA-VH ON 25-WLP (2.17x2.17) New 详细
SL55003S ON 6-SMD New 详细