产品系列

罗斌森
  • H11D1SR2M

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Number of Channels : 1
    Voltage - Isolation : 4170Vrms
    Current Transfer Ratio (Min) : 20% @ 10mA
    Turn On / Turn Off Time (Typ) : 5μs, 5μs
    Input Type : DC
    Output Type : Transistor with Base
    Voltage - Output (Max) : 300V
    Current - Output / Channel : 100mA
    Voltage - Forward (Vf) (Typ) : 1.15V
    Current - DC Forward (If) (Max) : 80mA
    Vce Saturation (Max) : 400mV
    Operating Temperature : -40°C ~ 100°C
    Mounting Type : Surface Mount
    Package / Case : 6-SMD, Gull Wing
    Supplier Device Package : 6-SMD

极速报价

型号
品牌 封装 批号 查看
NCP6925AFCT2G ON 36-WLCSP (2.4x2.4) New 详细
NCP301LSN46T1 ON 5-TSOP New 详细
BC856ALT3G ON SOT-23-3 (TO-236) New 详细
74ACT573PC ON 20-PDIP New 详细
NTMD6N02R2G ON 8-SOIC New 详细
FPF1007 ON 6-MicroFET (2x2) New 详细
MMSZ4700T1 ON SOD-123 New 详细
H11B1W ON 6-DIP New 详细
NTSB40120CT-1G ON I2PAK (TO-262) New 详细
NCP382HMN10AGEVB ON New 详细
FDME905PT ON MicroFet 1.6x1.6 Thin New 详细
CAT810STBI-GT3 ON SOT-23-3 New 详细
74ACT10SCX ON 14-SOIC New 详细
MC44608P75 ON 8-PDIP New 详细
KLI-4104-AAA-CP-AA ON New 详细
ES3C ON SMC (DO-214AB) New 详细
UC3845BD1 ON 8-SOIC New 详细
MC33064P-5G ON TO-92-3 New 详细
FAN4803CS2 ON 8-SOIC New 详细
FQB5N80TM ON D2PAK (TO-263AB) New 详细