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罗斌森
  • VSC8584XKS-06

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
SST39VF1682-70-4C-EKE Microchip 48-TSOP New 详细
ATSAM4CP16B-EK Microchip New 详细
DSC400-0111Q0087KE2 Microchip New 详细
DSC1101CM2-062.2080 Microchip New 详细
MIC4452BM Microchip 8-SOIC New 详细
PIC24F32KA302-I/SS Microchip 28-SSOP New 详细
DSC1003DE1-050.0000T Microchip New 详细
MCP40D17T-104E/LT Microchip SC-70-6 New 详细
U4037B-NFLY Microchip 24-SO New 详细
PIC16F1716-I/ML Microchip 28-QFN (6x6) New 详细
PIC16LC771-E/SO Microchip 20-SOIC New 详细
AT28C64-15JC Microchip 32-PLCC (13.97x11.43) New 详细
HV857MG-G Microchip 8-MSOP New 详细
PL123E-09HSC Microchip 16-SOP New 详细
MIC5282-5.0YMME Microchip 8-MSOP-EP New 详细
MA320020 Microchip New 详细
PIC18F24Q10-I/SO Microchip 28-SOIC New 详细
DSC1123BE2-125.0000 Microchip New 详细
MIC37300-1.8BR TR Microchip S-PAK-3 New 详细
DSPIC33EP128MC504-H/ML Microchip 44-QFN (8x8) New 详细