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罗斌森
  • VSC8584XKS-09

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
ATSAMD20G18A-MUT Microchip 48-QFN (7x7) New 详细
PIC16F1776-I/SS Microchip 28-SSOP New 详细
MCP33111D-10-E/MN Microchip 10-TDFN (3x3) New 详细
T5750-6AP Microchip New 详细
ATA5795-PNQW Microchip New 详细
AT27C010-55JI Microchip 32-PLCC (13.97x11.43) New 详细
MCP607-I/SN Microchip 8-SOIC New 详细
24LC32A/SN Microchip 8-SOIC New 详细
MCP1407-E/MF Microchip 8-DFN-S (6x5) New 详细
MCP2515-I/ST Microchip 20-TSSOP New 详细
U2043B-MFP Microchip 8-SO New 详细
MCP4531-502E/MS Microchip 8-MSOP New 详细
PL138-58OC-R Microchip 20-TSSOP New 详细
MIC5209-1.8BM Microchip 8-SOIC New 详细
AT27C512R-55RI Microchip 28-SOIC New 详细
DSC1033CE1-008.0000 Microchip New 详细
SY100HA643JY-TR Microchip 28-PLCC (11.48x11.48) New 详细
EMC1815T-1E/9R Microchip 10-VDFN (2.5x2) New 详细
AT17C128-10PC Microchip 8-PDIP New 详细
11AA02E48-I/SN Microchip 8-SOIC New 详细