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罗斌森
  • VSC8584XKS-09

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
DSPIC30F3013-30I/SP Microchip 28-SPDIP New 详细
DSC1121AM2-033.3330 Microchip New 详细
SW006021-1 Microchip New 详细
PIC18F27K40-I/SO Microchip 28-SOIC New 详细
MM5451YN Microchip 40-PDIP New 详细
AT28LV010-20TC Microchip 32-TSOP New 详细
SY100E142JC-TR Microchip 28-PLCC (11.48x11.48) New 详细
ATWEBEVK-01 Microchip New 详细
MIC502YN Microchip 8-PDIP New 详细
AT49F001-90TI Microchip 32-TSOP New 详细
SY55855VKI-TR Microchip 10-MSOP New 详细
PIC24FJ256GB110T-I/PT Microchip 100-TQFP (12x12) New 详细
MIC49300WR-TR Microchip S-PAK-5 New 详细
ATSAMD21E17D-MUT Microchip 32-QFN (5x5) New 详细
SY100S331JZ Microchip New 详细
MIC2086-MBQS Microchip 20-QSOP New 详细
PIC16LF18426T-I/SL Microchip 14-SOIC New 详细
AT25640N-10SC Microchip 8-SOIC New 详细
PIC16LC74AT-04I/PQ Microchip 44-MQFP (10x10) New 详细
PIC16LF18426-I/P Microchip 14-PDIP New 详细