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罗斌森
  • HLMPQ156AGR

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Part Status : Obsolete
    Mounting Type : Surface Mount
    Package / Case : 2-SMD, Gull Wing
    Supplier Device Package : Subminiature T-3/4
    Size / Dimension : 2.20mm L x 2.10mm W
    Height (Max) : 2.92mm

极速报价

型号
品牌 封装 批号 查看
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H11A53SD ON 6-SMD New 详细
FDMF6821C ON 40-PQFN (6x6) New 详细
MC33151P ON 8-PDIP New 详细
NTD5C434NT4G ON DPAK (SINGLE GAUGE) New 详细
2SK4085LS-1E ON TO-220F-3FS New 详细
MM74HCT164M ON 14-SOIC New 详细
SZMMSZ2V7T1G ON SOD-123 New 详细
CNY172FR2M ON 6-SMD New 详细
NCV33269DT-5.0G ON DPAK New 详细
KA741DTF ON 8-SOIC New 详细
LV8702VSLDGEVB ON New 详细
NVMFS5C628NLT3G ON 5-DFN (5x6) (8-SOFL) New 详细
NTMS4802NR2G ON 8-SOIC New 详细
NM95HS01EM8 ON 8-SO New 详细
H11A5300W ON 6-DIP New 详细
MC74LVXT4052MEL ON 16-SOEIAJ New 详细