产品系列

罗斌森
  • HLMPQ156AGR

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Part Status : Obsolete
    Mounting Type : Surface Mount
    Package / Case : 2-SMD, Gull Wing
    Supplier Device Package : Subminiature T-3/4
    Size / Dimension : 2.20mm L x 2.10mm W
    Height (Max) : 2.92mm

极速报价

型号
品牌 封装 批号 查看
5185-2N4392 ON New 详细
FGA90N33ATDTU ON TO-3P New 详细
74ABT2244CPC ON 20-PDIP New 详细
NCV33172DR2 ON 8-SOIC New 详细
FDA16N50-F109 ON TO-3PN New 详细
CAT5111YI-00-T3 ON New 详细
NCV86603BDT50RKG ON DPAK-5 New 详细
STK554-390A-E ON 29-SIP New 详细
2N5210_J05Z ON TO-92-3 New 详细
NTS2101PT1 ON SC-70-3 (SOT323) New 详细
74VHC4316MX ON 16-SOIC New 详细
ICTE-015G ON Axial New 详细
FQPF7N40 ON TO-220F New 详细
MOC223VM ON 8-SOIC New 详细
FL5160MX ON 10-SOIC New 详细
NVMFD5853NT1G ON 8-DFN (5x6) Dual Flag (SO8FL-Dual) New 详细
MC74VHC132DR2 ON 14-SOIC New 详细
NCV20081SQ3T2G ON SC-88A (SC-70-5/SOT-353) New 详细
MR2520L ON Microde Button New 详细
SFP9Z34 ON TO-220-3 New 详细