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罗斌森
  • HLMPQ156AZR

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Part Status : Obsolete
    Mounting Type : Surface Mount
    Package / Case : 2-SMD, Z-Bend
    Supplier Device Package : Subminiature T-3/4
    Size / Dimension : 2.20mm L x 2.10mm W
    Height (Max) : 2.92mm

极速报价

型号
品牌 封装 批号 查看
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H11SAXM_5598D ON New 详细
NCP4687DH18T1G ON SOT-89-5 New 详细
MMBZ5245ELT1 ON SOT-23-3 (TO-236) New 详细
NCP1011APL065R2G ON 7-PDIP, Gullwing New 详细
1SMA33AT3 ON SMA New 详细
74LVX00M ON 14-SOIC New 详细
GBPC2510W ON GBPC-W New 详细
1SMB18AT3 ON SMB New 详细
74VHC32MTC ON 14-TSSOP New 详细
1N5956BRLG ON Axial New 详细
FJP5027TU ON TO-220-3 New 详细
NTMS4404NR2 ON 8-SOIC New 详细
MC10ELT21DT ON 8-TSSOP New 详细
74F245MSAX ON 20-SSOP New 详细
FQPF5N60CYDTU ON TO-220F-3 (Y-Forming) New 详细
1N5388BG ON Axial New 详细