罗斌森
  • KAI-08670-FXA-JD-B1

  • Manufacturer : ON Semiconductor
    Packaging : Tray
    Part Status : Active
    Type : CCD
    Pixel Size : 7.4μm x 7.4μm
    Active Pixel Array : 3600H x 2400V
    Frames per Second : 12
    Voltage - Supply : 14.5V ~ 15.5V
    Package / Case : 72-BCPGA
    Supplier Device Package : 72-CPGA (47.24x45.34)
    Operating Temperature : -50°C ~ 70°C (TA)

极速报价

型号
品牌 封装 批号 查看
2N5638_D26Z ON TO-92-3 New 详细
SA575D ON 20-SOIC New 详细
MMBV109LT3G ON SOT-23-3 (TO-236) New 详细
NC7WZ07L6X ON 6-MicroPak New 详细
FDB86569-F085 ON D2PAK (TO-263AB) New 详细
TND525SS-TL-2H ON 8-SOIC New 详细
CAT811MTBI-GT3 ON SOT-143 New 详细
BD240B ON TO-220-3 New 详细
NTMFS4946NT1G ON 5-DFN (5x6) (8-SOFL) New 详细
MMSZ22T1G ON SOD-123 New 详细
FAN1616ASX ON SOT-223-4 New 详细
MURD550PFT4G ON DPAK New 详细
SMMBFJ310LT1G ON SOT-23-3 (TO-236) New 详细
H11B3300 ON 6-DIP New 详细
ILC5062AIC44X ON SC-70 (SOT323) New 详细
FPF1009 ON 6-MicroFET (2x2) New 详细
NCP115AMX180TCG ON New 详细
FJN3308RBU ON TO-92-3 New 详细
HGTP20N60A4 ON TO-220-3 New 详细
NCP2890AFCT2 ON 9-FlipChip New 详细