罗斌森
  • LE25S161PCTXG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 8-UDFN Exposed Pad
    Supplier Device Package : 8-UDFN (4x3)

极速报价

型号
品牌 封装 批号 查看
BC237ABU ON TO-92-3 New 详细
LV8702VBBGEVB ON New 详细
LM317D2TXM ON D2PAK New 详细
MBRD330 ON DPAK New 详细
NCV2951CDR2G ON 8-SOIC New 详细
DM74ALS37AN ON 14-PDIP New 详细
ES1J ON SMA (DO-214AC) New 详细
NTB75N03RT4 ON D2PAK New 详细
NTS260SFT3G ON SOD-123FL New 详细
FXLA102L8X ON 8-MicroPak? New 详细
CAT810MSDI-GT3 ON SC-70 New 详细
GBPC2506 ON GBPC New 详细
74LCX240SJX ON 20-SOP New 详细
MMBZ5257BLT1 ON SOT-23-3 (TO-236) New 详细
FJV3114RMTF ON SOT-23-3 (TO-236) New 详细
FCD3400N80Z ON DPAK New 详细
MBRB2545CT ON D2PAK-3 New 详细
NLAST44599DTR2 ON 16-TSSOP New 详细
KA1458 ON 8-DIP New 详细
NCP4586DSQ50T1G ON SC-82AB New 详细