罗斌森
  • LE25S161PCTXG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 8-UDFN Exposed Pad
    Supplier Device Package : 8-UDFN (4x3)

极速报价

型号
品牌 封装 批号 查看
NLU2G17AMX1TCG ON 6-ULLGA (1.45x1) New 详细
AMIS30532C5321G ON 32-NQFP (7x7) New 详细
MC74HC238ADR2G ON 16-SOIC New 详细
MC14555BCPG ON 16-DIP New 详细
NCP708MU330TAG ON 6-UDFN (3x3) New 详细
H11A617C3S ON 4-SMD New 详细
MICROFJ-SMA-30035-GEVB ON New 详细
1SMA5931BT3 ON SMA New 详细
MC14526BDWG ON 16-SOIC New 详细
FQL40N50 ON TO-264-3 New 详细
MDA6910C ON New 详细
NOIP1SE025KA-GDI ON New 详细
74F843SPC ON 24-PDIP New 详细
MOC8021SM ON 6-SMD New 详细
KSA1142YSTU ON TO-126-3 New 详细
CAT1027LI-42-G ON 8-PDIP New 详细
FDS4470 ON 8-SOIC New 详细
KAI-16050-QXA-JD-B1 ON 72-CPGA (47.24x45.34) New 详细
FDD390N15ALZ ON DPAK New 详细
CAT5126ZI-10-GT3 ON 8-MSOP New 详细