罗斌森
  • LE25S161PCTXG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 8-UDFN Exposed Pad
    Supplier Device Package : 8-UDFN (4x3)

极速报价

型号
品牌 封装 批号 查看
NTD3817N-1G ON I-PAK New 详细
FOD617A3SD ON 4-SMD New 详细
MBRB30H60CT-1G ON I2PAK (TO-262) New 详细
NB2305AI1D ON 8-SOIC New 详细
MC14025BCP ON 14-PDIP New 详细
XSPS1M001A-10 ON New 详细
FDC638APZ ON SuperSOT?-6 New 详细
MC74LVX138MEL ON 16-SOEIAJ New 详细
DM74S02N ON 14-PDIP New 详细
FDN306P ON SuperSOT-3 New 详细
N08L6182AB27I ON 48-BGA (6x8) New 详细
74LVQ32SJ ON 14-SOP New 详细
MC74HC573ADWG ON 20-SOIC New 详细
STK5Q4U362JGEVB ON New 详细
BCP56-10T3G ON SOT-223 (TO-261) New 详细
MC10H161M ON 16-SOEIAJ New 详细
H11L33SD ON 6-SMD New 详细
MBRS4201PT3G ON SMC New 详细
MC10H189M ON 16-SOEIAJ New 详细
74ACQ241SCX ON 20-SOIC New 详细