罗斌森
  • LE25S161PCTXG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 8-UDFN Exposed Pad
    Supplier Device Package : 8-UDFN (4x3)

极速报价

型号
品牌 封装 批号 查看
LV5236VZ-TLM-H ON 44-SSOP New 详细
MC78M09BDTRKG ON DPAK New 详细
FS6370-01G-XTD ON 16-SOIC New 详细
74ALVCH162244TX ON 48-TSSOP New 详细
MC10EP16VADR2G ON 8-SOIC New 详细
NVMFS6B05NLT1G ON 5-DFN (5x6) (8-SOFL) New 详细
NCP803SN293D2T1G ON SOT-23-3 (TO-236) New 详细
2N5088TF ON TO-92-3 New 详细
2N3906TA ON TO-92-3 New 详细
6785_2N4033 ON Die New 详细
MBRP745TU ON TO-220AC New 详细
HCPL0600_F132 ON 8-SOIC New 详细
MC74HCU04ANG ON 14-PDIP New 详细
DM74LS151N ON 16-PDIP New 详细
FAN7393AMX ON 14-SOP New 详细
AMIS30523C5231RG ON 52-QFN (8x8) New 详细
MC33260PG ON 8-PDIP New 详细
CAT825RTDI-GT3 ON TSOT-23-5 New 详细
100331QIX ON New 详细
NJW44H11G ON TO-3P-3L New 详细