罗斌森
  • NCP170ASN330T2G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active

极速报价

型号
品牌 封装 批号 查看
FQB55N06TM ON D2PAK (TO-263AB) New 详细
MC74HC273ADWG ON New 详细
MC10E122FNR2 ON 28-PLCC (11.51x11.51) New 详细
NC7SP32P5X ON SC-70-5 New 详细
SZMMSZ4685T1G ON SOD-123 New 详细
HUF76013P3 ON TO-220-3 New 详细
KSP14BU ON TO-92-3 New 详细
LM431SAIMFX ON SOT-23F-3 New 详细
FCD600N60Z ON D-Pak New 详细
1PMT16AT3 ON Powermite New 详细
NZL6V8AXV3T1 ON SC-89-3 New 详细
HMA121DR3V ON 4-SMD New 详细
MLD2N06CLT4G ON DPAK New 详细
MC74ACT125DG ON 14-SOIC New 详细
MOC212VM ON 8-SOIC New 详细
FMS6646MTC20X ON 20-TSSOP New 详细
NDD60N550U1-1G ON IPAK (TO-251) New 详细
NCP1397BDR2G ON 16-SOIC New 详细
2N5323 ON TO-5 New 详细
NTTFS4928NTAG ON 8-WDFN (3.3x3.3) New 详细