产品系列

罗斌森
  • LA6245P-TLM-E

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Series : *
    Part Status : Obsolete
    Mounting Type : Surface Mount
    Package / Case : 36-SOP (0.311", 7.90mm Width) Exposed Pad + 2 Heat Tabs
    Supplier Device Package : 36-HSOP-R

极速报价

型号
品牌 封装 批号 查看
MJ21196G ON TO-204 (TO-3) New 详细
NCP1117ST33T3 ON SOT-223 New 详细
KAI-08051-ABA-JP-BA ON 67-CPGA (33.02x20.07) New 详细
NCP1501DMR2 ON Micro8? New 详细
NCP59151DS50R4G ON D2PAK-5 New 详细
NUP4012PXV6T1G ON SOT-563 New 详细
MPSW63G ON TO-92 (TO-226) New 详细
SMUN5230DW1T1G ON SC-88/SC70-6/SOT-363 New 详细
74LVX273MX ON New 详细
NTSJ20100CTG ON TO-220FP New 详细
KA741DTF ON 8-SOIC New 详细
CD4021BCMX ON 16-SOIC New 详细
UF4001 ON DO-204AL (DO-41) New 详细
DM74ALS541SJX ON 20-SOP New 详细
FDD6635 ON D-PAK (TO-252) New 详细
LP2950CZ-5.0G ON TO-92-3 New 详细
2SK4065-E ON SMP New 详细
NTMFS4851NT1G ON 5-DFN (5x6) (8-SOFL) New 详细
STD3155L104T4G ON New 详细
FM93C66M8 ON 8-SO New 详细