罗斌森
  • NCV7450DB0R2G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : Automotive, AEC-Q100
    Part Status : Active
    Type : Buffer, Transceiver
    Mounting Type : Surface Mount
    Package / Case : 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
    Supplier Device Package : 16-TSSOP-EP

极速报价

型号
品牌 封装 批号 查看
FM93C46N ON 8-DIP New 详细
MBR230LSFT1H ON New 详细
BC857CLT1G ON SOT-23-3 (TO-236) New 详细
NTD24N06-001 ON I-PAK New 详细
CS5171GD8G ON 8-SOIC New 详细
FDS4935BZ ON 8-SOIC New 详细
74AC399SCX ON 16-SOIC New 详细
FQI1P50TU ON I2PAK (TO-262) New 详细
PN4092_D26Z ON TO-92-3 New 详细
MMFZ47T1G ON SOD-123 New 详细
NCP1234BD65R2G ON 7-SOIC New 详细
DM74S175N ON New 详细
FOD2743CS ON 8-SMD New 详细
FDS6680 ON 8-SOIC New 详细
QTLP650C23TR ON 1210 New 详细
CPH6443-TL-W ON 6-CPH New 详细
NVMFS5C442NLAFT3G ON 5-DFN (5x6) (8-SOFL) New 详细
FQNL1N50BBU ON TO-92-3 New 详细
NCP305LSQ16T1 ON SC-82AB New 详细
1N5233B_T50R ON DO-35 New 详细