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罗斌森

OPB860N11
Manufacturer : ON Semiconductor
Packaging : Bulk
Part Status : Obsolete
Mounting Type : Through Hole
Package / Case : Module, PC Pins, Slot Type

BD442S	ON	TO-126-3	New	详细
型号	品牌	封装	批号	查看
NCP1217AD100R2G	ON	8-SOIC	New	详细
74VHC86N	ON	14-PDIP	New	详细
MOC3041FR2VM	ON	6-SMD	New	详细
LC75852EHS-E	ON	64-PQFP (14x14)	New	详细
EFC4621R-A-TR	ON	EFCP1818-4CE-22	New	详细
FDC642P-F085	ON	SuperSOT?-6	New	详细
KSA1175RTA	ON	TO-92S	New	详细
FSB50325A	ON		New	详细
74LVX138MTC	ON	16-TSSOP	New	详细
1SV246-TL-EX	ON	3-MCP	New	详细
KSC2330YBU	ON	TO-92-3	New	详细
MPSA05RLRAG	ON	TO-92-3	New	详细
BCW32	ON	SOT-23-3	New	详细
BC307BU	ON	TO-92-3	New	详细
FDMF6707V	ON	40-PQFN (6x6)	New	详细
74LVX573MTCX	ON	20-TSSOP	New	详细
MM74HC573SJX	ON	20-SOP	New	详细
LM385D-2.5G	ON	8-SOIC	New	详细
LC82360-YJ2-TLM-E	ON		New	详细