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罗斌森

OPB860N55
Manufacturer : ON Semiconductor
Packaging : Bulk
Part Status : Obsolete
Mounting Type : Through Hole
Package / Case : Module, PC Pins, Slot Type

LB11868V-TLM-H	ON	20-SSOPJ	New	详细
型号	品牌	封装	批号	查看
NCP1392DDR2G	ON	8-SOIC	New	详细
H11A3M	ON	6-DIP	New	详细
MC74LVXC3245DWRG	ON	24-SOIC	New	详细
1N5245BTR	ON	DO-35	New	详细
NCP81001MNTWG	ON		New	详细
KSD1944TU	ON	TO-220F	New	详细
KAI-0340-AAA-CP-AA-DUAL	ON	22-CDIP	New	详细
2N3904_D81Z	ON	TO-92-3	New	详细
FSA4157AL6X_F087	ON	6-MicroPak	New	详细
NBVSPA013LN1TAG	ON	6-CLCC (7x5)	New	详细
MC74VHCT126ADR2G	ON	14-SOIC	New	详细
FQA11N90	ON	TO-3P	New	详细
74LCXH32245GX	ON	96-FBGA (13.5x5.5)	New	详细
74ACT16240MTD	ON	48-TSSOP	New	详细
FSUSB11MTCX	ON	14-TSSOP	New	详细
NCP1200AP100G	ON	8-PDIP	New	详细
KSD986YSTSSTU	ON	TO-126-3	New	详细
H11A33S	ON	6-SMD	New	详细
FJE3303H2	ON	TO-126-3	New	详细