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OPB860N55
Manufacturer : ON Semiconductor
Packaging : Bulk
Part Status : Obsolete
Mounting Type : Through Hole
Package / Case : Module, PC Pins, Slot Type

FDS4080N3	ON	8-SO	New	详细
型号	品牌	封装	批号	查看
FAN3100TSX	ON	SOT-23-5	New	详细
NLVHC32ADR2G	ON	14-SOIC	New	详细
MC74VHC1G86DTT1	ON	5-TSOP	New	详细
74VHC245MTCX	ON	20-TSSOP	New	详细
74ABT899CSC	ON	28-SOIC	New	详细
HLMP47199MP8A	ON		New	详细
KA7809AETU	ON	TO-220-3	New	详细
LM2931CD2TR4G	ON	D2PAK-5	New	详细
NCP1252CDR2G	ON	8-SOIC	New	详细
BC547BNMBU	ON	TO-92-3	New	详细
AR1331CPSF32SMFAH3-GEVB	ON		New	详细
MC14521BFG	ON	16-SOEIAJ	New	详细
NCP163AFCS180T2G	ON	4-WLCSP (0.64x0.64)	New	详细
NGTB30N120IHLWG	ON	TO-247	New	详细
NCP606MN50T2G	ON	6-DFN (3x3)	New	详细
MC100H641FNR2G	ON	28-PLCC (11.51x11.51)	New	详细
UC3845BVD1R2G	ON	8-SOIC	New	详细
MPSA92G	ON	TO-92-3	New	详细
ESD5481MUT5G	ON	2-X3DFN (0.62x0.32)	New	详细