产品系列

罗斌森
  • OPB860N55

  • Manufacturer : ON Semiconductor
    Packaging : Bulk
    Part Status : Obsolete
    Mounting Type : Through Hole
    Package / Case : Module, PC Pins, Slot Type

极速报价

型号
品牌 封装 批号 查看
MV5075C ON T-1 New 详细
FSDM311A ON 8-DIP New 详细
2N7002LT3G ON SOT-23-3 (TO-236) New 详细
NTMD6601NR2G ON 8-SOIC New 详细
MC100EL35DTG ON New 详细
CAT5401WI-50-T1 ON 24-SOIC New 详细
H22A2 ON New 详细
BC847CTT1G ON SC-75, SOT-416 New 详细
CNY172FM ON 6-SMD New 详细
74F825SCX ON New 详细
MMSZ5265BT1G ON SOD-123 New 详细
DM74ALS133MX ON 16-SOIC New 详细
MC74LVX8053DTR2 ON 16-TSSOP New 详细
FDZ201N ON 12-BGA (2x2.5) New 详细
74ACT374MTC ON New 详细
MC33160DWR2 ON 16-SOIC New 详细
MC10H165PG ON 16-DIP New 详细
NST3906DXV6T1G ON SOT-563 New 详细
MOC3163SVM ON 6-SMD New 详细
LMV358AM8X ON 8-SOIC New 详细