产品系列

罗斌森
  • OPB860T55

  • Manufacturer : ON Semiconductor
    Packaging : Bulk
    Part Status : Obsolete
    Mounting Type : Through Hole
    Package / Case : Module, PC Pins, Slot Type

极速报价

型号
品牌 封装 批号 查看
LC75808W-E ON 100-SQFP (14x14) New 详细
MC79M12CDTG ON DPAK New 详细
NCP5393MNR2G ON 48-QFN (7x7) New 详细
DM74LS163AN ON 16-PDIP New 详细
MC14106BDTR2 ON 14-TSSOP New 详细
KAI-04050-FBA-JB-B2 ON 67-CPGA (33.02x20.07) New 详细
ADT7473ARQZ-1 ON 16-QSOP New 详细
MC100EP35MNR4G ON New 详细
FDPF15N65 ON TO-220F New 详细
KA5Q0765RTYDTU ON TO-220F-5L (Forming) New 详细
74VCXH16244MTD ON 48-TSSOP New 详细
FL77905MX ON 8-SOP New 详细
FDD8647L ON D-PAK (TO-252) New 详细
MC100LVEL14DWR2G ON 20-SOIC New 详细
NSR0230M2T5G ON SOD-723 New 详细
FAN3122TMPX ON 8-MLP (3x3) New 详细
MC33567D-1R2G ON 8-SOIC New 详细
LC72720YVS-MPB-E ON 30-SSOP New 详细
CNW11AV1S ON 6-SMD New 详细
1N5356BG ON Axial New 详细