罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
MC74LVX540M ON SOEIAJ-20 New 详细
MC100EP08DTG ON 8-TSSOP New 详细
FDMS0302S ON 8-PQFN (5x6) New 详细
SZMM5Z4V3T1G ON SOD-523 New 详细
74F1071MTC ON 20-TSSOP New 详细
UC2843BDR2 ON 14-SOIC New 详细
MC44603ADWR2 ON 16-SOIC New 详细
LB1936V-TLM-E ON 16-SSOP New 详细
BZX79C6V8_T50R ON DO-35 New 详细
LM2576D2TR4-3.3 ON D2PAK-5 New 详细
MC74HC138ADG ON 16-SOIC New 详细
FDD6688 ON D-PAK (TO-252) New 详细
CS8191XDWFR20 ON 20-SOIC New 详细
74F521SJ ON New 详细
MBR2060CTG ON TO-220AB New 详细
NCP301LSN28T1G ON 5-TSOP New 详细
LM555CM ON 8-SOIC New 详细
SBT700-06RH-1E ON TO-3PF-3 New 详细
NCP1200P60 ON 8-PDIP New 详细
FQD10N20LTF ON TO-252, (D-Pak) New 详细