罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
MC100EP139MNG ON 20-QFN (4x4) New 详细
NE5532AD8G ON 8-SOIC New 详细
NCP803SN463T1 ON SOT-23-3 (TO-236) New 详细
1N969BTR ON DO-35 New 详细
MC7815ACD2TG ON D2PAK New 详细
NB7L14MN1TXG ON 16-QFN (3x3) New 详细
MC10EP17DTR2G ON 20-TSSOP New 详细
MMQA6V2T1G ON SC-74 New 详细
QTLP670C23TR ON 4-PLCC New 详细
SMMUN2134LT1G ON SOT-23-3 (TO-236) New 详细
ADM1028ARQ ON 16-QSOP New 详细
NB6L16DTR2 ON 8-TSSOP New 详细
NVMFS5C404NT1G ON 5-DFN (5x6) (8-SOFL) New 详细
CAX810STBI-T3 ON SOT-23 New 详细
H11AV1SM ON 6-SMD New 详细
FOD8316 ON 16-SOIC New 详细
DM74AS1004AN ON 14-PDIP New 详细
ADM1024ARU ON 24-TSSOP New 详细
KA7818E ON TO-220-3 New 详细
IRLI610ATU ON I2PAK (TO-262) New 详细