罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
NLU1GT50MUTCG ON 6-UDFN (1.2x1) New 详细
2N6427G ON TO-92-3 New 详细
MC100EP142MNR4G ON 32-QFN (5x5) New 详细
NCP3122MNTXG ON 32-QFN (5x5) New 详细
MC74VHCU04DR2 ON 14-SOIC New 详细
1N5232B_T26A ON DO-35 New 详细
CS5172GDR8 ON 8-SOIC New 详细
FDS2070N7 ON 8-SO New 详细
KSC1845PBU ON TO-92-3 New 详细
6N139S ON 8-SMD New 详细
NVD5C478NLT4G ON DPAK (SINGLE GAUGE) New 详细
ML4800CSX ON 16-SOIC New 详细
2N3904CTA ON TO-92-3 New 详细
FPF2214 ON 6-MicroFET (2x2) New 详细
FAN7710VLN ON 8-DIP New 详细
NC7S04M5X ON SOT-23-5 New 详细
MOC3022 ON 6-DIP New 详细
MC74LVX157M ON 16-SOEIAJ New 详细
NCP303LSN18T1 ON 5-TSOP New 详细
74ACT821SCX ON New 详细