罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
MT9V011D00STCC82SC1-305 ON New 详细
NVB6412ANT4G ON D2PAK-3 New 详细
MC10EP52DR2 ON New 详细
FCPF190N60E ON TO-220F New 详细
KA5532 ON 8-DIP New 详细
74LVC125ADR2G ON 14-SOIC New 详细
BC327ZL1 ON TO-92-3 New 详细
1N5256B_T50A ON DO-35 New 详细
MOC3041M ON 6-DIP New 详细
DSE010-TR-E ON New 详细
BUL146 ON TO-220AB New 详细
MPF990 ON TO-92-3 New 详细
NCV551SN32T1G ON 5-TSOP New 详细
74LVQ02SJ ON 14-SOP New 详细
MMQA18VT1 ON SC-74 New 详细
FXS03 ON New 详细
MC100EPT25DR2 ON 8-SOIC New 详细
FAN7385MX ON 14-SOP New 详细
HUFA76407D3 ON I-PAK New 详细
FDD3682-F085 ON TO-252AA New 详细