罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
CAV24C32YE-GT3 ON 8-TSSOP New 详细
74VHCT540AM ON 20-SOIC New 详细
NCP112P ON 14-PDIP New 详细
FJNS4201RBU ON TO-92S New 详细
MCT22023SD ON 6-SMD New 详细
DM74ALS00AN ON 14-PDIP New 详细
MBR2045CTH ON New 详细
SBC847BDW1T3G ON SC-88/SC70-6/SOT-363 New 详细
BZX79C3V9-T50A ON DO-35 New 详细
NCV551SN32T1G ON 5-TSOP New 详细
74F374SCX ON New 详细
FAN1117AT25 ON TO-220-3 New 详细
NTTFS5820NLTAG ON 8-WDFN (3.3x3.3) New 详细
P6KE11AG ON Axial New 详细
H11D2300W ON 6-DIP New 详细
P6SMB33AT3 ON SMB New 详细
DM74LS112AN ON New 详细
NTLUS3A18PZCTBG ON 6-UDFN (2x2) New 详细
NCP1052P44G ON 7-PDIP New 详细
LM2902VDG ON 14-SOIC New 详细