产品系列

罗斌森
  • MMBFJ177LT1G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    FET Type : P-Channel
    Voltage - Breakdown (V(BR)GSS) : 30V
    Current - Drain (Idss) @ Vds (Vgs=0) : 1.5mA @ 15V
    Voltage - Cutoff (VGS off) @ Id : 800mV @ 10nA
    Input Capacitance (Ciss) (Max) @ Vds : 11pF @ 10V (VGS)
    Resistance - RDS(On) : 300 Ohms
    Power - Max : 225mW
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : TO-236-3, SC-59, SOT-23-3
    Supplier Device Package : SOT-23-3 (TO-236)

极速报价

型号
品牌 封装 批号 查看
AX-SIP-SFEU-API-1-01-TX30 ON New 详细
FJV4106RMTF ON SOT-23-3 (TO-236) New 详细
MT9P031I12STC-DR ON 48-iLCC (10x10) New 详细
1SMB120AT3 ON SMB New 详细
1.5KE30ARL4 ON Axial New 详细
MC33071DR2G ON 8-SOIC New 详细
MCH4015-TL-H ON 4-MCPH New 详细
MCT2E300 ON 6-DIP New 详细
FSB50760SF ON New 详细
FQB34P10TM-F085 ON D2PAK (TO-263AB) New 详细
MM5Z3V6 ON SOD-523F New 详细
NTD60N02R-1G ON I-PAK New 详细
MC10E164FNR2G ON 28-PLCC (11.51x11.51) New 详细
MAX809RTRG ON SOT-23-3 (TO-236) New 详细
1SMB75CAT3 ON SMB New 详细
74LCX16500MTDX ON 56-TSSOP New 详细
MTP10N10ELG ON TO-220AB New 详细
BAS21_D87Z ON SOT-23-3 (TO-236) New 详细
BC307BZL1G ON TO-92-3 New 详细
NCL30086BDR2G ON 10-SOIC New 详细