产品系列

罗斌森
  • MMBFU310LT1G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    FET Type : N-Channel
    Voltage - Breakdown (V(BR)GSS) : 25V
    Drain to Source Voltage (Vdss) : 25V
    Current - Drain (Idss) @ Vds (Vgs=0) : 24mA @ 10V
    Voltage - Cutoff (VGS off) @ Id : 2.5V @ 1nA
    Input Capacitance (Ciss) (Max) @ Vds : 5pF @ 10V (VGS)
    Power - Max : 225mW
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : TO-236-3, SC-59, SOT-23-3
    Supplier Device Package : SOT-23-3 (TO-236)

极速报价

型号
品牌 封装 批号 查看
FDW2504P ON 8-TSSOP New 详细
74LVX32SJ ON 14-SOP New 详细
PCF8051LW ON New 详细
KAC-06040-ABA-JD-AA ON 237-MicroCPGA (42.5x38.1) New 详细
74ABT162244CSSX ON 48-SSOP New 详细
MC74LCX158MG ON 16-SOEIAJ New 详细
MC3488ADG ON 8-SOIC New 详细
1N5221B_T50R ON DO-35 New 详细
MC74HCT573ADTR2 ON 20-TSSOP New 详细
NCV8163ASN180T1G ON 5-TSOP New 详细
MC74HCT125ADR2G ON 14-SOIC New 详细
FSFM260N ON 8-DIP New 详细
MPS2222AZL1 ON TO-92-3 New 详细
UC3845BD1R2 ON 8-SOIC New 详细
HMA121CR2V ON 4-SMD New 详细
MC100H606FN ON 28-PLCC (11.51x11.51) New 详细
74ABT2541CSJ ON 20-SOP New 详细
MV6351 ON T-1 3/4 New 详细
FJN598JCBU ON TO-92-3 New 详细
NCV8603SN33T1G ON 5-TSOP New 详细