罗斌森
  • MMSZ4684T1G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Voltage - Zener (Nom) (Vz) : 3.3V
    Tolerance : ±5%
    Power - Max : 500mW
    Current - Reverse Leakage @ Vr : 7.5μA @ 1.5V
    Voltage - Forward (Vf) (Max) @ If : 900mV @ 10mA
    Operating Temperature : -55°C ~ 150°C
    Mounting Type : Surface Mount
    Package / Case : SOD-123
    Supplier Device Package : SOD-123

极速报价

型号
品牌 封装 批号 查看
MJD253-001 ON I-PAK New 详细
MCR12DCNT4 ON DPAK New 详细
NCP431AVLPRAG ON TO-92 (TO-226) New 详细
NCP3334DADJR2G ON 8-SOIC New 详细
TIP42G ON TO-220AB New 详细
ECH8653-TL-H ON 8-ECH New 详细
MC10EP35DT ON New 详细
SBAS16HT1G ON SOD-323 New 详细
BAS16XV2T1 ON SOD-523 New 详细
CS52015-1GDPR3 ON D2PAK-3 New 详细
2SK3823 ON TO-220 New 详细
KSK30OBU ON TO-92-3 New 详细
MPSA44G ON TO-92-3 New 详细
FST16292MEA ON 56-SSOP New 详细
MCH3374-TL-E ON SC-70FL/MCPH3 New 详细
LE25FW056CS-FH ON New 详细
MC3303DR2G ON 14-SOIC New 详细
MOC5007FR2M ON 6-SMD New 详细
NSR05F40NXT5G ON 2-DSN (1x.60) New 详细
FDPF5N50TYDTU ON TO-220F (LG-Formed) New 详细