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罗斌森
  • NCP12400BAHBB0DR2G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Package / Case : 8-SOIC (0.154", 3.90mm Width), 7 Leads
    Supplier Device Package : 7-SOIC
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
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MCR22-008 ON TO-92-3 New 详细
FDB2710 ON D2PAK New 详细
MPSA18RLRP ON TO-92-3 New 详细
74ALVC16827MTDX ON 56-TSSOP New 详细
QEB363YR ON New 详细
NSVR1020MW2T1G ON SOD-323 New 详细
MMBD1505A_D87Z ON SOT-23-3 New 详细
74LCX86MX ON 14-SOIC New 详细
NTDV20P06LT4G ON DPAK New 详细
NVMFS5C410NWFT1G ON 5-DFN (5x6) (8-SOFL) New 详细
MC74LVX125DR2G ON 14-SOIC New 详细
DM74LS73AN ON New 详细
FDMF5820TDC ON 31-PQFN (5x5) New 详细
CS5174EDR8G ON 8-SOIC New 详细
LV5068VGEVB ON New 详细
MC100EP196FAG ON 32-LQFP (7x7) New 详细