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罗斌森

NCP115CMX330TCG
Manufacturer : ON Semiconductor
Packaging : Cut Tape (CT)
Alternate Packaging
Series : *
Part Status : Active

FOD3182TSV	ON	8-SMD	New	详细
型号	品牌	封装	批号	查看
MCT2200	ON	6-DIP	New	详细
MC74ACT08DTR2	ON	14-TSSOP	New	详细
BC558BTF	ON	TO-92-3	New	详细
SZMM3Z47VT1G	ON	SOD-323	New	详细
NLX3G16CMX1TCG	ON	8-ULLGA (1.45x1)	New	详细
MUR260RL	ON	Axial	New	详细
FDB86563-F085	ON	D2PAK (TO-263)	New	详细
MC33151DG	ON	8-SOIC	New	详细
MM3Z43VC	ON	SOD-323F	New	详细
LV8483CS-TE-L-H	ON	10-WLP (2.47x.97)	New	详细
FAN5701UC08X	ON	16-WLCSP (1.71x1.71)	New	详细
LB11922-TLM-E	ON	36-SSOP	New	详细
FSTU6800QSCX	ON	24-QSOP	New	详细
NCP431BVPSNT1G	ON		New	详细
MMFZ22T1G	ON	SOD-123	New	详细
74ACT16543MTD	ON	56-TSSOP	New	详细
BD535J	ON	TO-220-3	New	详细
NCV317LBDG	ON	8-SOIC	New	详细
FDWS9509L-F085	ON	8-DFN (5.1x6.3)	New	详细