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罗斌森
  • NCP1611BDR2G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Mode : Current Controlled Frequency Foldback (CCFF), Critical Conduction (CRM)
    Current - Startup : 20μA
    Voltage - Supply : 9.5V ~ 35V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
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NLAS7242MUTBG ON 10-UQFN (1.4x1.8) New 详细
NCV78L08ABDR2G ON 8-SOIC New 详细
NLU1G32BMX1TCG ON 6-ULLGA (1.2x1) New 详细
MR750G ON Microde Button New 详细
J309G ON TO-92-3 New 详细
ADP3194JRUZ-RL ON 28-TSSOP New 详细
NTST30100CTH ON New 详细
MC33164P-3RAG ON TO-92-3 New 详细
100336QIX ON 28-PLCC (11.43x11.43) New 详细
FLZ30VB ON SOD-80 New 详细
PN2484_D75Z ON TO-92-3 New 详细
NRVBS360T3G ON SMC New 详细
NLAS7213MUTBG ON 8-UQFN (1.5x1.5) New 详细
KAF-6303-12-5-A-EVK ON New 详细
FAN1112DX ON D-PAK (TO-252) New 详细
LP2950ACDT-3.0RK ON DPAK New 详细
MMBD6100LT3 ON SOT-23-3 (TO-236) New 详细