罗斌森
  • NCP361MUTBG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Mixed Technology
    Number of Circuits : 1
    Applications : General Purpose
    Mounting Type : Surface Mount
    Package / Case : 6-UDFN Exposed Pad
    Supplier Device Package : 6-UDFN (2x2)

极速报价

型号
品牌 封装 批号 查看
MM74HC165MTC ON 16-TSSOP New 详细
J106 ON TO-92-3 New 详细
74F163APC ON 16-PDIP New 详细
FQI7P06TU ON I2PAK (TO-262) New 详细
H11G2300W ON 6-DIP New 详细
74LVX163SJX ON 16-SOP New 详细
MM3Z47VC ON SOD-323F New 详细
NGTB40N120FL2WG ON TO-247 New 详细
SMMBD914LT3G ON SOT-23 New 详细
MMBTA63 ON SOT-23-3 New 详细
CAT24C208WI-G ON 8-SOIC New 详细
CAT93C56XI ON 8-SOIC New 详细
FMS6243MTC14X ON 14-TSSOP New 详细
74VCX162240MTDX ON 48-TSSOP New 详细
NL17SZ32XV5T2G ON SOT-553 New 详细
RGF1D ON DO-214AC (SMA) New 详细
MC74LVX257MEL ON 16-SOEIAJ New 详细
H11C1300W ON 6-DIP New 详细
F5D1B ON New 详细
CAT24C164WI-GT3 ON 8-SOIC New 详细