罗斌森
  • NCP361SNT1G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Mixed Technology
    Number of Circuits : 1
    Applications : General Purpose
    Mounting Type : Surface Mount
    Package / Case : SOT-23-5 Thin, TSOT-23-5
    Supplier Device Package : 5-TSOP

极速报价

型号
品牌 封装 批号 查看
GMC2985C ON New 详细
FSTU16862MTDX ON 48-TSSOP New 详细
FQPF3N80 ON TO-220F New 详细
ADP3199JCPZ-RL ON 32-LFCSP-VQ (5x5) New 详细
MC10H175P ON 16-DIP New 详细
STK621-061C-E ON New 详细
NCV8505D2T33R4 ON D2PAK-7 New 详细
FDW2507NZ ON 8-TSSOP New 详细
FQA27N25 ON TO-3PN New 详细
QTLP650C23TR ON 1210 New 详细
MM74HC4316M ON 16-SOIC New 详细
1N5252B_S00Z ON DO-35 New 详细
FAN3241TMX ON 8-SOIC New 详细
MMBT2907A-D87Z ON SOT-23-3 New 详细
CNY17F43SD ON 6-SMD New 详细
MC14023BFEL ON SOEIAJ-14 New 详细
2SK4094-1E ON TO-220-3 New 详细
LM324AN ON 14-DIP New 详细
MC74AC245NG ON 20-PDIP New 详细
NCV8406ADTRKG ON DPAK New 详细