罗斌森
  • NLAS5223BMNR2G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Switch Circuit : SPDT
    Multiplexer/Demultiplexer Circuit : 2:1
    Number of Circuits : 2
    On-State Resistance (Max) : 350 mOhm
    Channel-to-Channel Matching (δRon) : 50 mOhm (Max)
    Voltage - Supply, Single (V+) : 1.65V ~ 4.5V
    Switch Time (Ton, Toff) (Max) : 50ns, 50ns
    -3db Bandwidth : 19MHz
    Charge Injection : 38pC
    Channel Capacitance (CS(off), CD(off)) : 60pF
    Current - Leakage (IS(off)) (Max) : 500nA
    Crosstalk : -70dB @ 100kHz
    Operating Temperature : -40°C ~ 85°C (TA)
    Package / Case : 10-WFQFN
    Supplier Device Package : 10-WQFN (1.4x1.8)

极速报价

型号
品牌 封装 批号 查看
NB2308AI1DTR2G ON 16-TSSOP New 详细
STK672-050-E ON 22-SIP New 详细
BVSS84LT1G ON SOT-23-3 New 详细
QVB11333 ON New 详细
LA6500L-FA-E ON New 详细
MC7809ECDTXM ON TO-252, (D-Pak) New 详细
KAI-16000-AXA-JP-B2 ON 40-PGA (44.45x45.34) New 详细
NE592D14R2 ON 14-SOIC New 详细
FQA33N10 ON TO-3P New 详细
4N35FR2VM ON 6-SMD New 详细
NCP160FCT2GEVB ON New 详细
FQU13N10LTU ON I-PAK New 详细
FQD630TM ON D-Pak New 详细
MOC5007VM ON 6-DIP New 详细
74F251ASJX ON 16-SOP New 详细
FSB50550U ON New 详细
DM74ALS1000AMX ON 14-SOIC New 详细
CNY17F3S ON 6-SMD New 详细
MC10H352FN ON 20-PLCC (9x9) New 详细
NCV8161AMX330TBG ON 4-XDFN (1x1) New 详细