罗斌森
  • NCP6336BFCCT1G

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Mounting Type : Surface Mount
    Package / Case : 20-UFBGA, WLCSP
    Supplier Device Package : 20-WLCSP (1.62x2.02)

极速报价

型号
品牌 封装 批号 查看
FQD16N25CTM ON D-Pak New 详细
MC74VHCT373ADWR2 ON 20-SOIC New 详细
NCP5080MUTXG ON 12-LLGA (3x3) New 详细
AX-SFEU-API-1-01-TX30 ON New 详细
74F374SCX ON New 详细
MC74ACT374DWR2G ON New 详细
NUS6160MNTWG ON 22-QFN (3x4) New 详细
MC74VHC240DWR2 ON 20-SOIC New 详细
NCP1011ST130T3G ON SOT-223 New 详细
QL332YD ON T-1 3/4 (5mm) New 详细
74HC574DTR2G ON New 详细
NCP585LSAN18T1G ON 6-HSON New 详细
FST3244QSCX ON 20-QSOP New 详细
MC74LCX14DR2 ON 14-SOIC New 详细
NCP4671DSN15T1G ON SOT-23-5 New 详细
LV8805V-MPB-H ON 36-SSOPJ New 详细
MMSZ5258BT3 ON SOD-123 New 详细
MC74VHCT139AMEL ON 16-SOEIAJ New 详细
NTMFS4939NT1G ON 5-DFN (5x6) (8-SOFL) New 详细
FLZ3V9A ON SOD-80 New 详细