罗斌森
  • NCP6336BFCCT1G

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Mounting Type : Surface Mount
    Package / Case : 20-UFBGA, WLCSP
    Supplier Device Package : 20-WLCSP (1.62x2.02)

极速报价

型号
品牌 封装 批号 查看
LV8498CTGEVK ON New 详细
FQP18N50V2 ON TO-220-3 New 详细
NTD4905NT4G ON DPAK New 详细
NCV303LSN22T1G ON 5-TSOP New 详细
74ACTQ08SJ ON 14-SOP New 详细
RHRP860-F102 ON TO-220-2 New 详细
NBC12429FAG ON 32-LQFP (7x7) New 详细
MJF18004G ON TO-220FP New 详细
MC74LCX06MELG ON SOEIAJ-14 New 详细
NSBC114EF3T5G ON SOT-1123 New 详细
FAN48630UC50X ON 16-WLCSP (1.78x1.78) New 详细
LV5851M-TLM-H ON 8-MFP New 详细
KBL10 ON KBL New 详细
LA1781M-MPB-E ON 64-QIPE (14x14) New 详细
MC33274ADR2G ON 14-SOIC New 详细
LM358DG ON 8-SOIC New 详细
MC74LVXC3245DWRG ON 24-SOIC New 详细
FAN53555UC24X ON 20-WLCSP (1.96x1.56) New 详细
FFPF20UA60DNT ON TO-220F New 详细
NCV551SN15T1G ON 5-TSOP New 详细