罗斌森
  • NCP6336BFCCT1G

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Mounting Type : Surface Mount
    Package / Case : 20-UFBGA, WLCSP
    Supplier Device Package : 20-WLCSP (1.62x2.02)

极速报价

型号
品牌 封装 批号 查看
MC10H352FNR2 ON 20-PLCC (9x9) New 详细
LC75824W-E ON 64-STQFP (10x10) New 详细
MM3Z3V6ST1 ON SOD-323 New 详细
NZQA5V6XV5T1 ON SOT-553 New 详细
MPS6531 ON TO-92-3 New 详细
MMSZ5236ET1 ON SOD-123 New 详细
FDP120N10 ON TO-220-3 New 详细
AR0141CS2C00SUEAH-GEVB ON New 详细
NSVBAS21TMR6T1G ON SC-74 New 详细
1N5333BG ON Axial New 详细
MC34064D-5R2 ON 8-SOIC New 详细
NVMFS5C460NLWFAFT1G ON 5-DFN (5x6) (8-SOFL) New 详细
AMIS30585C5852G ON 28-PLCC (11.51x11.51) New 详细
FSA3341UMX ON 16-UMLP (1.8x2.6) New 详细
GMC7475C ON New 详细
CM1213A-01SO ON SOT-23-3 New 详细
STR-LOGIC-GATES-EVK ON New 详细
NVMFS5C442NLT1G ON 5-DFN (5x6) (8-SOFL) New 详细
LC75883WHS-E ON 80-SQFP New 详细
74VHC04SJ ON 14-SOP New 详细